Kuan-Ting Lin's Location
Cincinnati, OH, US
Kuan-Ting Lin's Work
- Thermal Product Design Engineer @ Apple
- Research Assistant - Thermal Fluid and Thermal Processing Lab (TFTPL) @ University of Cincinnati - College of Engineering and Applied Science
- Research Assistant - Thermal Fluid and Thermal Processing Lab (TFTPL) @ University of Cincinnati - College of Engineering and Applied Science
- Research Assistant - Thermal Fluid and Thermal Processing Lab (TFTPL) @ University of Cincinnati - College of Engineering and Applied Science
- Research Assistant @ University of Cincinnati
- Thermal Engineer @ ASUS
- Research Assistant @ National Tsing Hua University
Kuan-Ting Lin's Education
- University of Cincinnati
PhD (Mechanical Engineering)
2016 - 2020 - National Tsing Hua University
Master's degree (Mechanical Engineering)
2009 - 2011 - National Tsing Hua University
Bachelor's degree (Mechanical Engineering)
2005 - 2009
Kuan-Ting Lin's Summary
Kuan-Ting Lin, based in Cincinnati, OH, US, is currently a Thermal Product Design Engineer at Apple, bringing experience from previous roles at University of Cincinnati - College of Engineering and Applied Science and UC-Siemens Simulation Technology Center, University of Cincinnati. Kuan-Ting Lin holds a 2016 - 2020 PhD in Mechanical Engineering @ University of Cincinnati. Kuan-Ting Lin has 1 email on RocketReach.
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