Kenny Lee Email & Phone Number
Lead package integration @ Lightmatter
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Kenny Lee Location
- California, United States
Kenny Lee Work
- Lead package integration @ (October 2026 - Present)
- Director, Package Development @ (August 2025 - September 2026)
- Silicon Package Development @ (October 2021 - April 2025)
- Principal IC Package RnD Engineer @ (May 2017 - September 2021)
- Principal IC Packaging Engineer @ (December 2016 - May 2017)
- Principal Packaging Engineer @ (March 2016 - November 2016)
- Staff IC Bump and CPI and Packaging Eng'r @ (February 2012 - November 2015)
- Staff IC Package Eng'r @ (April 2008 - January 2012)
- Senior IC Bump and Packaging Eng'r @ (March 2005 - March 2008)
- Senior Package Development Engineer @ (December 2000 - March 2005)
Kenny Lee Education
- Hongik University
Master's degree (Materials Science and Technology)
1999-2000 - Hongik University
Bachelor's degree (Materials Science and Technology)
1992-1998
Kenny Lee Skills
- 3D
- ASIC
- Analog
- CMOS
- Characterization
- Continuous Improvement
- Cross-functional Team Leadership
- Design for Manufacturing
- Design of Experiments
- Electrical Engineering
- Electronics
- Engineering
- Engineering Management
- FMEA
- Failure Analysis
- IC
- JMP
- Lean Manufacturing
- MEMS
- Management
- Manufacturing
- Manufacturing Engineering
- Materials
- Materials Science
- Metrology
- Microelectronics
- Mixed Signal
- PCB Design
- Process Engineering
- Process Integration
- Process Simulation
- Product Development
- Product Engineering
- Product Management
- Quality Management
- R&D
- RF
- Reliability
- Research and Development (R&D)
- Root Cause Analysis
- SPC
- Semiconductor Industry
- Semiconductors
- Silicon
- Simulations
- Six Sigma
- Thin Films
- Wafer Bonding
- Wafer Fab
- Yield
- Packaging
- Research And Development R&D
- Embedded Systems
- Program Management
- Cross Functional Team Leadership
- JavaScript
- Research and Development
Kenny Lee Summary
- Kenny Lee, based in California, United States, is currently a Lead package integration at Lightmatter. Kenny Lee brings experience from previous roles at CScale, Meta, Broadcom Inc. and Intersil Corporation. Kenny Lee holds a 1999 - 2000 Master's degree in Materials Science and Technology @ Hongik University. With a robust skill set that includes 3D, ASIC, Analog, CMOS, Characterization and more. Kenny Lee has 1 emails and 1 mobile phone numbers on RocketReach.
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