Ken Brown Location
Tempe, AZ, US
Ken Brown Work
- 2021 - now Vice President, Silicon Photonic Packaging @ Intel Corporation
- 1998 - now Design @ Intel Corporation
- 2018 - 2021 Senior Director, Connectivity Group Packaging @ Intel Corporation
- 2011 - 2021 Senior Director, Intel Assembly and Test Technology Development @ Intel Corporation
- 2007 - 2011 Director, Intel Package Design @ Intel Corporation
- 2001 - 2007 Director, Intel Communication and Wireless Packaging @ Intel Corporation
- Package Design Manager @ Digital Equipment Corporation
Ken Brown Education
- Northeastern University
MBA (High Technology Program)
- University of Massachusetts Amherst
Bachelor of Science - BS (Mechanical Engineering)
Ken Brown Summary
Ken Brown, based in Tempe, AZ, US, is currently a Vice President, Silicon Photonic Packaging at Intel Corporation. Ken Brown brings experience from previous roles at Intel Corporation. Ken Brown holds a MBA in High Technology Program @ Northeastern University. Ken Brown has 2 emails and 2 mobile phone numbers on RocketReach.
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