2021 -
now Vice President, Silicon Photonic Packaging @
1998 -
now Design @
2018 -
2021 Senior Director, Connectivity Group Packaging @
2011 -
2021 Senior Director, Intel Assembly and Test Technology Development @
2007 -
2011 Director, Intel Package Design @
2001 -
2007 Director, Intel Communication and Wireless Packaging @
now Package Design Manager @ Digital Equipment Corporation
Ken Brown Education
Northeastern University
University of Massachusetts Amherst
Ken Brown Summary
Ken Brown, based in Tempe, AZ, US, is currently a Vice President, Silicon Photonic Packaging at Intel Corporation. Ken Brown brings experience from previous roles at Intel Corporation. Ken Brown holds a Northeastern University. Ken Brown has 4 emails and 2 mobile phone numbers on RocketReach.
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