Kan Zhang's Location
Hillsboro, OR, US
Kan Zhang's Work
- TD Module Integration Yield Engineer @ Intel Corporation
- Principal Engineer Yield Enhancement @ Micron Technology
- Senior Member Of Technical Staff Integration and Yield @ GlobalFoundries
- Member of Technical Staff Integration and Yield @ GlobalFoundries
- Characterization Engineer @ IBM
- Research Scientist @ Corning Incorporated
- Research Assistant @ University of Wisconsin-Madison
- Research Assistant @ Tsinghua University
Kan Zhang's Education
- University of Wisconsin-Madison
Ph.D. (Electrical Engineering)
2007 - 2011 - Tsinghua University
Master (Microelectronics)
2005 - 2007 - Tsinghua University
Bachelor's degree (Electrical Engineering)
2001 - 2005
Kan Zhang's Skills
- Semiconductor Device
- Physics
- Solar Cells
- Photonics
- Nanofabrication
- Scanning Electron Microscopy
- Matlab
- Nanotechnology
- Electronics
- TEM
Kan Zhang's Summary
Kan Zhang, based in Hillsboro, OR, US, is currently a TD Module Integration Yield Engineer at Intel Corporation, bringing experience from previous roles at Micron Technology, GLOBALFOUNDRIES and IBM. Kan Zhang holds a 2007 - 2011 Ph.D. in Electrical Engineering @ University of Wisconsin-Madison. With a robust skill set that includes Semiconductor Device, Physics, Solar Cells, Photonics, Nanofabrication and more, Kan Zhang contributes valuable insights to the industry. Kan Zhang has 4 emails on RocketReach.
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