Kam Lee Email & Phone Number
Sr. Director, Deputy Head of Advanced Packaging Technology and Service @ TSMC
5 free lookup(s). No credit card required.
If you need more lookups,
subscriptions start at $34 USD/month.
Kam Lee Location
- Taiwan
Kam Lee Work
- Sr. Director, Deputy Head of Advanced Packaging Technology and Service @ (April 2022 - Present)
- VP and GM of Volume Product Engineering and Manufacturing Product Engineering Malaysia @ (January 2020 - April 2022)
- Senior Director, Assembly and Test Manufacturing NPI @ (September 2018 - March 2020)
- Senior Director, Sort Test TD Asia Product Engineering @ (January 2016 - August 2018)
- Site Director, Assembly Test Technology Development Malaysia @ (May 2011 - August 2018)
- Sr Enginering Manager, Sort Test Technology Development @ (May 2006 - January 2016)
- Test R and D Engineer @ (May 1999 - April 2006)
- Product Development Engineer @ (May 1995 - April 1999)
Kam Lee Education
- Universiti Sains Malaysia
Masters (MBA)
2000-2002 - Universiti Malaya
Bachelor (Electrical & Electronic Engineering)
1991-1995
Kam Lee Summary
- Kam Lee, based in Taiwan, is currently a Sr. Director, Deputy Head of Advanced Packaging Technology and Service at TSMC. Kam Lee brings experience from previous roles at Intel Corporation. Kam Lee holds a 2000 - 2002 Masters in MBA @ Universiti Sains Malaysia. Kam Lee has 2 mobile phone numbers on RocketReach.
Looking for a different Kam Lee?
Find contact details for 700 million professionals.
G2 Crowd Trusted
300K+ Plugin Users
© 2026 RocketReach.co