Kam Lee Email & Phone Number
Sr. Director, Deputy Head of Advanced Packaging Technology and Service @ TSMC
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Kam Lee Location
- Taiwan
Kam Lee Work
- 2022 -now Sr. Director, Deputy Head of Advanced Packaging Technology and Service @
- 2020 -2022 VP and GM of Volume Product Engineering and Manufacturing Product Engineering Malaysia @
- 2018 -2020 Senior Director, Assembly and Test Manufacturing NPI @
- 2016 -2018 Senior Director, Sort Test TD Asia Product Engineering @
- 2011 -2018 Site Director, Assembly Test Technology Development Malaysia @
- 2006 -2016 Sr Enginering Manager, Sort Test Technology Development @
- 1999 -2006 Test R and D Engineer @
- 1995 -1999 Product Development Engineer @
Kam Lee Education
- Universiti Sains Malaysia
Masters (MBA)
2000-2002 - Universiti Malaya
Bachelor (Electrical & Electronic Engineering)
1991-1995
Kam Lee Summary
- Kam Lee, based in Taiwan, is currently a Sr. Director, Deputy Head of Advanced Packaging Technology and Service at TSMC. Kam Lee brings experience from previous roles at Intel Corporation. Kam Lee holds a 2000 - 2002 Masters in MBA @ Universiti Sains Malaysia. Kam Lee has 1 emails and 2 mobile phone numbers on RocketReach.
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