Junbo Yang Email & Phone Number
IC Package Design Researcher @ Nokia Bell Labs
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Junbo Yang Location
- New York, NY, US
Junbo Yang Work
- 2026 -now IC Package Design Researcher @
- 2025 -2026 Postdoctoral Research Associate @
- 2020 -2025 Research Assistant @
Junbo Yang Education
- Binghamton University
Master of Science - MS (Mechanical Engineering)
2017-2019 - 北京化工大学
Bachelor's degree (过程装备与控制工程(Process Equipment and Control Engineering）)
2013-2017 - Binghamton University
Doctor of Philosophy - PhD (mechanical engineering)
2020
Junbo Yang Summary
- Junbo Yang, based in New York, NY, US, is currently a IC Package Design Researcher at Nokia Bell Labs. Junbo Yang brings experience from previous roles at Binghamton University. Junbo Yang holds a 2017 - 2019 Master of Science - MS in Mechanical Engineering @ Binghamton University. Junbo Yang has 1 mobile phone numbers on RocketReach.
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