Jun Fang's Location
Boise, ID, US
Jun Fang's Work
- TD Staff Process Engineer - Dry Etch @ Intel Corporation
- Senior Process Engineer @ Micron Technology
- Process Engineer @ Micron Technology
- Graduate Research Assistant @ University of Minnesota
- Graduate Research Assistant @ University of Kentucky
Jun Fang's Education
- University of Minnesota-Twin Cities
Doctor of Philosophy (Ph.D.) (Electrical and Electronics Engineering)
- University of Minnesota-Twin Cities
Master’s Degree (Electrical and Electronics Engineering)
- University of Kentucky
Electrical and Electronics Engineering
Jun Fang's Skills
- Physics
- Spectroscopy
- AutoCAD
- Matlab
- Semiconductor Packaging
- Sensors
- MEMS
- Nanoparticles
- Semiconductor Fabrication
- JMP
Jun Fang's Summary
Jun Fang, based in Boise, ID, US, is currently a TD Staff Process Engineer - Dry Etch at Intel Corporation, bringing experience from previous roles at Micron Technology, University of Minnesota and University of Kentucky. Jun Fang holds a Doctor of Philosophy (Ph.D.) in Electrical and Electronics Engineering @ University of Minnesota-Twin Cities. With a robust skill set that includes Physics, Spectroscopy, AutoCAD, Matlab, Semiconductor Packaging and more, Jun Fang contributes valuable insights to the industry. Jun Fang has 1 email on RocketReach.
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