Julia Zhao Email & Phone Number
Principal Engineer, Sensor and Module Packaging Engineering @ Analog Devices
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Julia Zhao Location
- Andover, MA, US
Julia Zhao Work
- 2020 -now Principal Engineer, Sensor and Module Packaging Engineering @
- 2006 -2020 Sr. Staff Packaging Engineer, Program Leader @
- 2000 -2006 Senior Reliability Engineer @
Julia Zhao Education
- University at Buffalo
Ph.D (Engineering Mechanics (Electronic Packaging))
1996-2000 - Tongji University
Master of Engineering (M.Eng.)
Julia Zhao Skills
- sensor integration
- Material Characterization
- Process Failure Mode Effects Analysis (PFMEA)
- Root Cause Analysis
- Optical module packaging
- flip chip packaging, SiP
- sensor products
- FMEA
- Semiconductors
- Manufacturing
- Mixed Signal
- Process Simulation
- Reliaility and Quality
- Thermal mechanical simulation
- Subcontractor management
- Global Sourcing
- Project Management
- Low Cost Manufacturing
- Analog
- Cross-functional Team Leadership
- Design of Experiments
- Failure Analysis
- Engineering Management
- Electronics
- Digital Signal Processors
- Development
- SIP
- Embedded Systems
- Cross Functional Team Leadership
- Flip Chip Packaging
Julia Zhao Summary
- Julia Zhao, based in Andover, MA, US, is currently a Principal Engineer, Sensor and Module Packaging Engineering at Analog Devices. Julia Zhao brings experience from previous roles at Analog Devices. Julia Zhao holds a 1996 - 2000 Ph.D in Engineering Mechanics (Electronic Packaging) @ University at Buffalo. With a robust skill set that includes sensor integration, Material Characterization, Process Failure Mode Effects Analysis (PFMEA), Root Cause Analysis, Optical module packaging and more. Julia Zhao has 1 emails and 1 mobile phone numbers on RocketReach.
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