Joseph Hanson Email & Phone Number
Silicon Packaging Architect @ Intel Corporation
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Joseph Hanson Location
- United States
Joseph Hanson Work
- Silicon Packaging Architect @ (June 2026 - Present)
- Technical Lead Engineer @ (November 2025 - June 2026)
- Thermal and Mechanical Systems Engineer @ (November 2022 - November 2025)
- Test R and D Engineer @ (November 2021 - November 2022)
- Thermal and Mechanical Systems Engineer @ (December 2015 - November 2021)
- Thermal and Mechanical Engineering Intern @ (March 2015 - December 2015)
- Research Lab Assistant @ MultiPhysics Lab: ASU Fulton Undergraduate Research Initiative (FURI) (May 2014 - May 2015)
- Local Project Lead @ (August 2013 - December 2014)
- Undergraduate Researcher @ Nano-Engineered Thermal Radiation Group: ASU Fulton Undergraduate Research Initi (May 2013 - May 2014)
- Technical Lead Engineer @ (November 2025 - Present)
Joseph Hanson Education
- Arizona State University
Master of Science - MS (Mechanical Engineering)
2015-2018 - Arizona State University
Bachelor of Science in Engineering (Mechanical Engineering)
2013-2015 - Paradise Valley Community College
Associate of Science (A.S.) (General Studies)
2008-2011
Joseph Hanson Summary
- Joseph Hanson, based in United States, is currently a Silicon Packaging Architect at Intel. Joseph Hanson brings experience from previous roles at Electronic Cooling Solutions, Inc. and Intel Corporation. Joseph Hanson holds a 2015 - 2018 Master of Science - MS in Mechanical Engineering @ Arizona State University. Joseph Hanson has 2 emails and 4 mobile phone numbers on RocketReach.
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