John Xie Email & Phone Number
AMD Fellow, AECG Packaging Technology @ AMD
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John Xie Location
- Fremont, CA, US
John Xie Work
- 2025 -now AMD Fellow, AECG Packaging Technology @
- 1999 -now Board of Directors @ CIE-USA/SF
- 2016 -2025 Camera Module Integration @
- 2015 -2016 Director, Packaging Technology Research and Development @ Intel Corporation, PSG (Programmable Solution Group) BU (formally Altera Corp)
- 1999 -2015 Director, Packaging Technology Research and Development @ Altera Corp.
John Xie Education
- University Of California - Berkeley
(Physics)
1990-1994 - Institute of Physics, Chinese Academy of Sciences
Doctor Of Philosophy
- Peking University
(Physics)
John Xie Skills
- IC
- Semiconductor Industry
- Technology Development
- Engineering
- Manufacturing
- Supply Chain
- Signal Integrity
- Semiconductors
- Device Physics
- SoC
- Silicon
- R&D
- Reliability
- Assembly
- Electronics
- ASIC
- Patents
- FPGA
- Semiconductor Manufacturing
- SPC
- Design for Manufacturing
- Failure Analysis
- DFM
- PCB design
- Testing
- Packaging
- Statistics
- Engineering Management
- Modeling
- EDA
- Simulations
- Microelectronics
- MEMS
- CMOS
- Analog
- Product Engineering
- Design of Experiments
- Digital Signal Processors
- Package Management
- Hardware Architecture
- Technical Marketing
- VLSI
- Embedded Systems
- Thin Films
- Integrated Circuit Design
- 3D Packaging
- Interconnect
- Physics
- Thermal Management
- Technology
- Design
- Die
- Integration
John Xie Summary
- John Xie, based in Fremont, CA, US, is currently a AMD Fellow, AECG Packaging Technology at AMD. John Xie brings experience from previous roles at CIE-USA/SF, Apple, Intel Corporation, PSG (Programmable Solution Group) BU (formally Altera Corp) and Altera Corp.. John Xie holds a 1990 - 1994 University Of California - Berkeley. With a robust skill set that includes IC, Semiconductor Industry, Technology Development, Engineering, Manufacturing and more. John Xie has 2 emails and 1 mobile phone numbers on RocketReach.
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