Embedded Software Engineer @ (September 2021 - April 2025)
Associate Cyber Software Engineer @ (August 2020 - September 2021)
Software Engineer Intern @ (May 2019 - August 2019)
John Verhoff Education
University of Michigan
Master of Engineering - MEng (Systems Engineering)
2023-2025
Purdue University
Bachelor of Science - BS (Computer Science)
2017-2020
John Verhoff Summary
John Verhoff, based in Cleveland, OH, US, is currently a Embedded Software Team Lead at Rockwell Automation. John Verhoff brings experience from previous roles at Rockwell Automation, Northrop Grumman and Raytheon. John Verhoff holds a 2023 - 2025 Master of Engineering - MEng in Systems Engineering @ University of Michigan. John Verhoff has 3 emails and 1 mobile phone numbers on RocketReach.
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