John Miranda Email & Phone Number

Driving Innovation in Advanced Semiconductor Packaging (3D-IC, SiPh and CPO, SiP) and Digital Healthcare @ Goertek Microelectronics Inc.

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John Miranda Location

Santa Clara, CA, US

John Miranda Work

2025 -now Driving Innovation in Advanced Semiconductor Packaging (3D-IC, SiPh and CPO, SiP) and Digital Healthcare @
2019 -2025 Vice President Business Development and Sales, MEMS and Sensors Unit @
2017 -2019 Global Director of MEMS and Sensors Business Unit @
2011 -2017 Business Development and Marketing Manager, Industrial and Optics Division @
2010 -2011 Sr. Product Marketing Manager - Americas, Mobile Phone Cameras and Image Sensors @
2010 -2010 Senior Program Manager, Kinect for Xbox 360, Sensors and Cameras @
2008 -2010 High Volume Manufacturing Technology and Business Manager @
2007 -2008 Technology Project Leader, Wafer Level Cameras and Wafer Level Optics @
2006 -2007 Europe Regional Marketing Manager and Customer Programs Manager, Micron's Image Sensor Group @
2004 -2006 Product Marketing Manager, Image Sensors (1Mp, 3Mp, 5Mp), Micron's Image Sensor Group @
2000 -2003 Sr. Mechanical Engineer - System-in-Package (SiP): Camera Modules, RF Modules, and Memory Cards @
1998 -1999 Product Development Engineer - Doctoral Professional Internship @
1996 -1998 Advanced Materials Development Engineer - Doctoral Professional Internship @

John Miranda Education

Texas A&M University
(Doctorate, Mechanical Engineering, m. Financial Management, Class of '99)
The University of Texas at El Paso
(MSME, Mechanical Engineering)
The University of Texas at El Paso
(BSME, Mechanical Engineering)

John Miranda Skills

aka A Solutions Accelerator
Advanced Technology Innovation & Management
International Sales & Marketing
Business Development
Product Marketing
Product Management
Sales Operations
Product Development
Semiconductors
R&D
Operations Management
Supply Chain Management
P&L Management
Digital Marketing
Integrated Marketing Communications
Entrepreneurship
Environmental Health & Safety
Embedded Systems
Engineering Management
Cross-functional Team Leadership
Strategic Leadership
Personnel Management
Contract Negotiation
Global Sales & Marketing Team Management
Advanced Semiconductor Packaging (SiP) design to high volume
CMOS Image Sensors
Optical Design, Manufacturing, and Test
Wafer Level Cameras & Optics Design to Manufacture
Laser Scanning MEMS Pico Projection
LiDAR (Solid State, Scanning, ADAS, Drone)
Infrared Imaging (Optical Gas Imaging, Thermal)
MEMS Sensors
PaaS Automation, Edge Computing & Data Analytics
Semiconductor Fab Operations Management
Manufacturing Assembly Automation Design
Innovation Thinking & Development
Technology and Product Roadmapping
Product Strategy
Technology Management
Go-to-Market Strategy and Execution
Product Development Leadership
Design for Manufacturability (DfX)
Product Lifecylce Mangement
Supply Chain Architect to Vendor Qualification
Strategic Partner Relationship Management
Key Account Mangement
B2B B2C Marketing and Sales
Corporate Change Management
Precision Agriculture
Oil & Gas Regulatory Affairs
Optics
Consumer Electronics
Sensors
Electronics
Energy
Engineering
Microsoft Office
CMOS
Marketing
Cross Functional Team Leadership
Manufacturing
SoC
Polymers
Management
Marketing Strategy
Continuous Improvement
Patents
Materials Research
Global Contract Negotiation
Channel
Marketing And Sales Strategy
Go To Market Strategy And Execution
Innovation Thinking And Development
Drone
Advanced Semiconductor Packaging Sip Design To High Volume
Scanning
Edge Computing And Data Analytics
Oil And Gas Regulatory Affairs
Laser Based Scanning Mems Pico Projection Assembly And Test
Wafer Level Packaging
Lidar Solid State
Design For Manufacturability Dfx
Camera And Optics Design
Establishing Strategic Partnerships
Global Marketing And Sales Team Management
Sales Operations Internal
Thermal
Adas
Executive Management Marketing And Sales
Infrared Imaging Optical Gas Imaging
Environmental Health And Safety
Paas Automation
Infrared Imaging
LiDAR
Advanced Semiconductor Packaging Design to High Volume
Design for Manufacturability

John Miranda Summary

John Miranda, based in Santa Clara, CA, US, is currently a Driving Innovation in Advanced Semiconductor Packaging (3D-IC, SiPh and CPO, SiP) and Digital Healthcare at Goertek Microelectronics Inc.. John Miranda brings experience from previous roles at Carsem, JCET / STATS ChipPAC Ltd., Konica Minolta Business Solutions U.S.A., Inc. and Sharp Electronics. John Miranda holds a Texas A&M University. With a robust skill set that includes aka A Solutions Accelerator, Advanced Technology Innovation & Management, International Sales & Marketing, Business Development, Product Marketing and more. John Miranda has 3 emails and 4 mobile phone numbers on RocketReach.