Manufacturing Process Engineer @ (September 2017 - February 2018)
Sr. Product Development and Cost Reduction and End of Life Management @ (January 2014 - July 2017)
Product Development and Mechanical Designer @ (January 2000 - December 2013)
Circuit Pack Product Engineer @ (February 1993 - December 1999)
Circuit Pack Process Engineer @ *AT&T Network Systems (June 1990 - January 1993)
Member of Technical Staff 1 @ AT&T Microelectronics (August 1984 - May 1990)
John Arp Education
Virginia Tech
BSME (Mechanical Engineering)
Purdue University
MSIE (Industrial Engineering)
John Arp Summary
John Arp, based in Columbus, OH, US, is currently a Product Review Engineer at Boeing. John Arp brings experience from previous roles at Scharp Properties LLC, Dynalab, Inc., Nokia and Alcatel-Lucent Enterprise. John Arp holds a BSME in Mechanical Engineering @ Virginia Tech. John Arp has 2 emails on RocketReach.
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