2014 -2017 Sr. Product Development and Cost Reduction and End of Life Management @
2000 -2013 Product Development and Mechanical Designer @
1993 -1999 Circuit Pack Product Engineer @
1990 -1993 Circuit Pack Process Engineer @ *AT&T Network Systems
1984 -1990 Member of Technical Staff 1 @ AT&T Microelectronics
John Arp Education
Purdue University
Virginia Tech
John Arp Summary
John Arp, based in Columbus, OH, US, is currently a Product Review Engineer at Boeing. John Arp brings experience from previous roles at Scharp Properties LLC, Dynalab, Inc., Nokia and Alcatel-Lucent Enterprise. John Arp holds a Purdue University. John Arp has 2 emails on RocketReach.
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