Joe Mayo's Location
Ben Lomond, CA, US
Joe Mayo's Work
- Packaging Failure Analysis Engineer @ Broadcom
- Failure Analysis Engineer @ FIB International (EAG Labs)
- Failure Analysis Tech @ Intel Corporation
Joe Mayo's Education
- University of Phoenix
BSBM (Business Management)
2004 - 2006 - Ort Braude College of Engineering
A (Mechanical Engineering)
1993 - 1994
Joe Mayo's Skills
- Program Management
- Failure Analysis
- Analytical Skills
- R&d
- EDX
- CMOS
- Development
- Semiconductors
- IC
- Product Engineering
Joe Mayo's Summary
Joe Mayo, based in Ben Lomond, CA, US, is currently a Packaging Failure Analysis Engineer at Broadcom Limited, bringing experience from previous roles at FIB International (EAG Labs) and Intel Corporation. Joe Mayo holds a 2004 - 2006 BSBM in Business Management @ University of Phoenix. With a robust skill set that includes Program Management, Failure Analysis, Analytical Skills, R&d, EDX and more, Joe Mayo contributes valuable insights to the industry. Joe Mayo has 4 emails and 1 mobile phone number on RocketReach.
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