Joe Mayo Email & Phone Number
Packaging Failure Analysis Engineer @ Broadcom
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Joe Mayo Location
- Ben Lomond, CA, US
Joe Mayo Work
- Packaging Failure Analysis Engineer @ (April 2010 - Present)
- Failure Analysis Engineer @ FIB International (EAG Labs) (February 2007 - December 2009)
- Failure Analysis Tech @ (April 1997 - December 2006)
Joe Mayo Education
- University of Phoenix
BSBM (Business Management)
2004-2006 - Ort Braude College of Engineering
A (Mechanical Engineering)
1993-1994
Joe Mayo Skills
- Program Management
- Failure Analysis
- Analytical Skills
- R&d
- EDX
- CMOS
- Development
- Semiconductors
- IC
- Product Engineering
- Design of Experiments
- PCB design
- Analysis
- Yield
- SQL
- Semiconductor Industry
- Engineering
- Leadership
- Project Planning
- Debugging
- SEM
- Project Management
- Mechanical Engineering
- Microscopy
- Quality Management
- TEM
- FIB
- Manufacturing
- JMP
- Financial Analysis
- Electronics
- Metrology
Joe Mayo Summary
- Joe Mayo, based in Ben Lomond, CA, US, is currently a Packaging Failure Analysis Engineer at Broadcom Limited. Joe Mayo brings experience from previous roles at FIB International (EAG Labs) and Intel Corporation. Joe Mayo holds a 2004 - 2006 BSBM in Business Management @ University of Phoenix. With a robust skill set that includes Program Management, Failure Analysis, Analytical Skills, R&d, EDX and more. Joe Mayo has 2 emails and 6 mobile phone numbers on RocketReach.
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