Joe Dickson Email & Phone Number

SVP Chip to Chip Reliability and Innovation @ Wus Printed Circuit (Kunshan) Co., Ltd

5 free lookup(s).

Joe Dickson Location

Livermore, CA, US

Joe Dickson Work

2019 - now SVP Chip to Chip Reliability and Innovation @ Wus Printed Circuit (Kunshan) Co., Ltd
2014 - 2019 SR VP Product Operations and Innovations @ Wus Printed Circuit (Kunshan) Co., Ltd
2013 - 2014 Co-Founder @ NextGIn Technology BV

2010 - 2013 PCB Product and Manufacturing Engineering @ Consultant for Asia Manufacturing
2002 - 2013 Six Sigma Master Black Belt COE @ Cisco
2002 - 2006 PCB Technical Global Supplier Manager @ Cisco
1997 - 2002 Sr Director Engineering and Technology @ TE Connectivity
1992 - 1997 Director of Engineering @ South Bay Circuits, Inc.
View Department
1989 - 1992 Product Manager, PCB Chemistry @ Armstrong World Industries
1987 - 1989 Tech Sales Rep @ Enthone Chemistries

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Joe Dickson Education

MBA TM Technology Management
2001 - 2004

Joe Dickson Skills

Six Sigma
Manufacturing
Process Engineering

Product Development
Cross-functional Team Leadership
SPC
Engineering
Manufacturing Engineering
Process Improvement
Design for Manufacturing

see less

Joe Dickson Summary

Joe Dickson, based in Livermore, CA, US, is currently a SVP Chip to Chip Reliability and Innovation at Wus Printed Circuit (Kunshan) Co., Ltd. Joe Dickson brings experience from previous roles at Wus Printed Circuit (Kunshan) Co., Ltd, NextGIn Technology BV, Consultant for Asia Manufacturing and Cisco Systems. Joe Dickson holds a 2001 - 2004 MBA TM Technology Management. With a robust skill set that includes Six Sigma, Manufacturing, Process Engineering, Product Development, Cross-functional Team Leadership and more. Joe Dickson has 2 emails and 2 mobile phone numbers on RocketReach.

Joe Dickson Emails

Found 2 emails

Joe Dickson Phone Numbers

Found 6 phone numbers

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