Joe Dickson Email & Phone Number
SVP Chip to Chip Reliability and Innovation @ Wus Printed Circuit (Kunshan) Co., Ltd
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Joe Dickson Location
- Livermore, CA, US
Joe Dickson Work
- SVP Chip to Chip Reliability and Innovation @ (December 2019 - Present)
- SR VP Product Operations and Innovations @ (January 2014 - December 2019)
- Co-Founder @ (October 2013 - January 2014)
- PCB Product and Manufacturing Engineering @ Consultant for Asia Manufacturing (January 2010 - December 2013)
- PCB Technical Global Supplier Manager @ (March 2002 - May 2006)
- Six Sigma Master Black Belt COE @ (March 2002 - December 2013)
- Sr Director Engineering and Technology @ (March 1997 - January 2002)
- Director of Engineering @ (January 1992 - January 1997)
- Product Manager, PCB Chemistry @ (January 1989 - January 1992)
- Tech Sales Rep @ Enthone Chemistries (January 1987 - January 1989)
- Process Engineering Manger @ Symtron/NTI (January 1982 - January 1987)
- Eng. Tech, Process Engineer @ (January 1977 - January 1982)
Joe Dickson Education
- MBA TM Technology Management
MBA TM (Technology Management)
2001-2004
Joe Dickson Skills
- Six Sigma
- Manufacturing
- Process Engineering
- Product Development
- Cross-functional Team Leadership
- SPC
- Engineering
- Manufacturing Engineering
- Process Improvement
- Design for Manufacturing
- Product Management
- Operations Management
- Program Management
- Lean Manufacturing
- Continuous Improvement
- FMEA
- Engineering Management
- Testing
- PCB design
- Design of Experiments
- Electronics
- Quality System
- Quality Assurance
- Failure Analysis
- Management
- Manufacturing Operations Management
- Product Engineering
- Product Lifecycle Management
- Supply Chain Management
- Quality Management
- Simulations
- Supply Management
- Strategy
- Process Simulation
- Manufacturing Operations
- R&D
- Semiconductors
- Business Process
- ISO
- Automation
- Leadership
- Contract Manufacturing
- Supplier
- DFM
- Operational Excellence
- Supply Chain
- Facility Master Planning
- Mentoring
- PCB layout design
- PCB Engineering
- Customer Service
- Information Technology
- Operations
- Public Speaking
- Project Management
- Cross Functional Team Leadership
Joe Dickson Summary
- Joe Dickson, based in Livermore, CA, US, is currently a SVP Chip to Chip Reliability and Innovation at Wus Printed Circuit (Kunshan) Co., Ltd. Joe Dickson brings experience from previous roles at Wus Printed Circuit (Kunshan) Co., Ltd, NextGIn Technology BV, Consultant for Asia Manufacturing and Cisco Systems. Joe Dickson holds a 2001 - 2004 MBA TM in Technology Management @ MBA TM Technology Management. With a robust skill set that includes Six Sigma, Manufacturing, Process Engineering, Product Development, Cross-functional Team Leadership and more. Joe Dickson has 3 mobile phone numbers on RocketReach.
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Top Wus Printed Circuit (Kunshan) Co., Ltd Employees
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