Jisung Yang Email
Principal IC Packaging Engineer @ Silicon Mitus
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Jisung Yang Location
- Seongnam-si, KR
Jisung Yang Work
- Principal IC Packaging Engineer @ (April 2022 - Present)
- Senior Technical Program Manager @ (October 2018 - April 2022)
- IC Packaging Engineer @ SFA Semicon (January 2015 - October 2018)
- IC Packaging Engineer @ (February 2012 - January 2015)
Jisung Yang Education
- Myongji University
Bachelor's degree (Materials Engineering)
2005-2012
Jisung Yang Summary
- Jisung Yang, based in Seongnam-si, KR, is currently a Principal IC Packaging Engineer at Silicon Mitus. Jisung Yang brings experience from previous roles at NEPES Corp., SFA Semicon and Amkor Technology, Inc.. Jisung Yang holds a 2005 - 2012 Bachelor's degree in Materials Engineering @ Myongji University. Jisung Yang has 1 emails on RocketReach.
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