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Jim Eckel Location
Harrison, OH, US
Jim Eckel Work
Lead Packaging Engineer @ (March 2026 - Present)
Customer Technical Services Manager @ (December 2023 - January 2026)
Snowboard Instructor @ (December 2020 - July 2024)
Senior Packaging Technologist @ (August 2022 - November 2023)
Senior Packaging Engineer @ (May 2020 - June 2022)
Packaging Engineer @ (November 2018 - May 2020)
Senior Packaging Engineer @ (May 2018 - November 2018)
Packaging Engineer @ (September 2014 - December 2017)
Packaging Engineer @ (January 1994 - August 2014)
Jim Eckel Education
Purdue University
Certificate (Business Administration and Management, General)
2026-2026
University of Colorado Boulder
Certificate (Project Management)
2024-2025
University of Cincinnati
Bachelor's degree (Bachelor's degree)
1988-1992
Jim Eckel Summary
Jim Eckel, based in Harrison, OH, US, is currently a Lead Packaging Engineer at Kenvue. Jim Eckel brings experience from previous roles at Genera, Perfect North Slopes, Maple Leaf Foods Inc and Greenleaf Foods. Jim Eckel holds a 2026 - 2026 Certificate in Business Administration and Management, General @ Purdue University. Jim Eckel has 4 mobile phone numbers on RocketReach.
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