Jerome Teysseyre Email & Phone Number

Vice President - Package development and engineering @ onsemi

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Jerome Teysseyre's Location

Phoenix, AZ, US

Jerome Teysseyre's Work

Vice President - Package development and engineering @ onsemi
Vice President - Assembly Technology and Package Development Group @ Fairchild Semiconductor
Director - Corporate Packaging and Automation @ STMicroelectronics

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Manager R and D - Packaging, Bumping and wafer preparation @ Sofradir
Assembly technologies R and D manager ( Grenoble - France) @ STMicroelectronics

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Jerome Teysseyre's Education

Université Joseph Fourier (Grenoble I)
Engineer (Material sciences)
1997 - 2000

Jerome Teysseyre's Skills

Semiconductors
R&D
Microelectronics

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IC
Characterization
Thin Films
Materials Science
MEMS
Failure Analysis
Electronics

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Jerome Teysseyre's Summary

Jerome TEYSSEYRE, based in Phoenix, AZ, US, is currently a Vice President - Package development and engineering at ON Semiconductor, bringing experience from previous roles at Fairchild, STMicroelectronics and Sofradir. Jerome TEYSSEYRE holds a 1997 - 2000 Engineer in Material sciences @ Université Joseph Fourier (Grenoble I). With a robust skill set that includes Semiconductors, R&D, Microelectronics, IC, Characterization and more, Jerome TEYSSEYRE contributes valuable insights to the industry. Jerome TEYSSEYRE has 2 emails and 1 mobile phone number on RocketReach.

Jerome Teysseyre Email Address

Found 2 email address listings:

Jerome Teysseyre Phone Number

Found 1 phone number:

659113XXXX

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