Jeff Yang's Location

Cupertino, CA, US

Jeff Yang's Work

  • Manager Product Operations @ Meta
  • SiP and PCBA and DFM Lead @ Apple
  • Packaging and Manufacturing Manager @ Analog Devices
  • Director, Flip Chip and Wafer Level Packaging @ JCET Group
  • Director, Advanced Packaging @ Amkor Technology, Inc.
  • IC Packaging and Process Manager @ Texas Instruments (acquired by Micron)

Jeff Yang's Education

  • University College London (UCL), University of London

    Ph.D (Mechanical Engineering)

Jeff Yang's Skills

  • Bga
  • Packaging
  • Technology
  • Engineering Management
  • Cross Functional Team
  • Reliability
  • Semiconductor Manufacturing
  • Program Manager
  • Semiconductor Packaging
  • Sensors

Jeff Yang's Summary

Jeff Yang, based in Cupertino, CA, US, is currently a Manager Product Operations at Meta, bringing experience from previous roles at Apple, Analog Devices, STATS ChipPAC and Amkor Technology. Jeff Yang holds a Ph.D in Mechanical Engineering @ University College London (UCL), University of London. With a robust skill set that includes Bga, Packaging, Technology, Engineering Management, Cross Functional Team and more, Jeff Yang contributes valuable insights to the industry. Jeff Yang has 4 emails on RocketReach.

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