LTD Module Development Engineer - Dry Etch @ (December 2022 - November 2024)
Software development Engineer @ (April 2022 - December 2022)
Graduate Student Researcher @ (September 2020 - September 2021)
Quality Control Engineer @ (May 2021 - August 2021)
Process Engineer @ (May 2018 - September 2019)
Engineering Intern @ (June 2017 - July 2017)
Jaya M. Education
University at Buffalo
JNTUH College of Engineering Hyderabad
Jaya M. Skills
JMP
AWS CloudFormation
Amazon Web Services (AWS)
Microsoft Excel
Team Management
Matlab
Nanotechnology
Public Relations
Chemical Engineering
UV/Vis Spectroscopy
Microsoft Office
C (Programming Language)
Microsoft Word
Skilled Multi-tasker
Public Speaking
COMSOL
Public Seminars
Sports Enthusiast
Teamwork
Quality Control
Product Testing
Good Manufacturing Practice (GMP)
FTIR
Moisture Analysis
Process Improvement
Process Engineering
Reporting & Analysis
Pharmacovigilance
U.S. Pharmacopeia (USP)
U.S. Title 21 CFR Part 11 Regulation
U.S. Food and Drug Administration (FDA)
Regulatory Analysis
Standard Operating Procedure (SOP)
Organization Skills
Product Development
Cross-functional Team Leadership
MEMS Design
Semiconductors
Chemical Mechanical Polishing
Statistical Process Control (SPC)
Java
Python (Programming Language)
Jaya M. Summary
Jaya M., based in New Mexico, United States, is currently a Advanced Packaging Module Engineer - Die Prep at Intel Corporation. Jaya M. brings experience from previous roles at Intel Corporation, Amazon Web Services (AWS), University at Buffalo and Cipla. Jaya M. holds a University at Buffalo. With a robust skill set that includes JMP, AWS CloudFormation, Amazon Web Services (AWS), Microsoft Excel, Team Management and more. Jaya M. has 1 emails and 1 mobile phone numbers on RocketReach.
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