Jaya M. Email & Phone Number
Advanced Packaging Module Engineer - Die Prep @ Intel Corporation
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Jaya M. Location
- New Mexico, United States
Jaya M. Work
- 2024 -now Advanced Packaging Module Engineer - Die Prep @
- 2022 -2024 LTD Module Development Engineer - Dry Etch @
- 2022 -2022 Software development Engineer @
- 2020 -2021 Graduate Student Researcher @
- 2021 -2021 Quality Control Engineer @
- 2018 -2019 Process Engineer @
- 2017 -2017 Engineering Intern @
Jaya M. Education
- University at Buffalo
- JNTUH College of Engineering Hyderabad
Jaya M. Skills
- JMP
- AWS CloudFormation
- Amazon Web Services (AWS)
- Microsoft Excel
- Team Management
- Matlab
- Nanotechnology
- Public Relations
- Chemical Engineering
- UV/Vis Spectroscopy
- Microsoft Office
- C (Programming Language)
- Microsoft Word
- Skilled Multi-tasker
- Public Speaking
- COMSOL
- Public Seminars
- Sports Enthusiast
- Teamwork
- Quality Control
- Product Testing
- Good Manufacturing Practice (GMP)
- FTIR
- Moisture Analysis
- Process Improvement
- Process Engineering
- Reporting & Analysis
- Pharmacovigilance
- U.S. Pharmacopeia (USP)
- U.S. Title 21 CFR Part 11 Regulation
- U.S. Food and Drug Administration (FDA)
- Regulatory Analysis
- Standard Operating Procedure (SOP)
- Organization Skills
- Product Development
- Cross-functional Team Leadership
- MEMS Design
- Semiconductors
- Chemical Mechanical Polishing
- Statistical Process Control (SPC)
- Java
- Python (Programming Language)
Jaya M. Summary
- Jaya M., based in New Mexico, United States, is currently a Advanced Packaging Module Engineer - Die Prep at Intel Corporation. Jaya M. brings experience from previous roles at Intel Corporation, Amazon Web Services (AWS), University at Buffalo and Cipla. Jaya M. holds a University at Buffalo. With a robust skill set that includes JMP, AWS CloudFormation, Amazon Web Services (AWS), Microsoft Excel, Team Management and more. Jaya M. has 1 emails and 1 mobile phone numbers on RocketReach.
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