Senior Staff Engineer Design and Material Test @ (July 2014 - January 2015)
Design and Material Test Engineer @ (April 2004 - July 2014)
PACKAGE DEVELOPMENT ENGR @ (April 2003 - April 2004)
R and D Engineer @ (May 1998 - March 2003)
Process Maintenance Technician @ VALOR Electronics Philippines Inc (November 1996 - May 1998)
Jasper Ocampo Education
Batangas State University
Bachelor of Science (B.S.) (Electrical Engineering)
1991-1996
Batangas National HighSchool 1987-1991
Jasper Ocampo Skills
Analog
CMOS
Characterization
Design of Experiments
Electronics
Engineering
FMEA
Failure Analysis
IC
JMP
Manufacturing
Mixed Signal
PCB design
Product Engineering
R&D
SAP Drawing Generations
SPC
Semiconductor Industry
Semiconductor Process
Semiconductors
Silicon
Simulations
Testing
Yield
Reliability
Design
Process Engineering
Jasper Ocampo Summary
Jasper Ocampo, based in Calabarzon, Philippines, is currently a Senior Staff Engineer Package Platform Development at Infineon Technologies. Jasper Ocampo brings experience from previous roles at Infineon Technologies and Amkor Technology. Jasper Ocampo holds a 1991 - 1996 Bachelor of Science (B.S.) in Electrical Engineering @ Batangas State University. With a robust skill set that includes Analog, CMOS, Characterization, Design of Experiments, Electronics and more. Jasper Ocampo has 2 emails on RocketReach.
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