James Teslow's Location

Madison, WI, US

James Teslow's Work

  • Associate Packaging Engineer @ Abbott

James Teslow's Education

  • Michigan State University

    Bachelor's Degree (Packaging Engineering)

    2010 - 2012
  • Lansing Community College

    Engineering

    2009 - 2010
  • Henry Ford Community College

    Engineering

    2007 - 2009

James Teslow's Skills

  • Injection Molding
  • Packaging
  • Premade Pouches
  • PowerPoint
  • Pouches
  • Extrusion
  • Cross Functional Team
  • Barrier Films
  • Windows
  • Plastics

James Teslow's Summary

James Teslow, based in Madison, WI, US, is currently a Sr. Packaging Engineer at Energizer Holdings, bringing experience from previous roles at American Packaging Corporation, CP Flexible packaging and Abbott. James Teslow holds a 2010 - 2012 Bachelor's Degree in Packaging Engineering @ Michigan State University. With a robust skill set that includes Injection Molding, Packaging, Premade Pouches, PowerPoint, Pouches and more, James Teslow contributes valuable insights to the industry. James Teslow has 3 emails on RocketReach.
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