Jaesik Lee Email & Phone Number

Jaesik Lee Email & Phone Number

VP Package Engineering, SK Hynix America @ SK hynix America

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Jaesik Lee's Location

California, United States

Jaesik Lee's Work

Jaesik Lee's Education

  • University of Waterloo

Jaesik Lee's Skills

  • MEMS
  • Process Integration
  • Materials
  • Thin Films
  • Integrated Circuits Ic
  • R&d
  • Embedded Systems
  • CMOS
  • Characterization
  • Design of Experiments

Jaesik Lee's Summary

Jaesik Lee, based in California, United States, is currently a VP Package Engineering, SK Hynix America at SK hynix America Inc., bringing experience from previous roles at Meta, Google, NVIDIA and Oracle. Jaesik Lee holds a University of Waterloo. With a robust skill set that includes MEMS, Process Integration, Materials, Thin Films, Integrated Circuits Ic and more, Jaesik Lee contributes valuable insights to the industry. Jaesik Lee has 3 emails on RocketReach.

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