Jack Tie Email
Embedded Software Engineer @ Adappt
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Jack Tie Location
- London, GB
Jack Tie Work
- Embedded Software Engineer @ (December 2025 - Present)
- Embedded Software Engineer @ (March 2025 - November 2025)
- Junior Electronic Engineer @ (June 2024 - January 2025)
- IoT Engineer @ (March 2023 - August 2024)
- Platform Engineer @ (June 2022 - December 2022)
- Avionics Specialist for Endeavour @ (October 2021 - October 2022)
Jack Tie Education
- The University of Edinburgh
Bachelor of Engineering - BE (Electrical and Electronics Engineering)
2019-2023
Jack Tie Summary
- Jack Tie, based in London, GB, is currently a Embedded Software Engineer at Adappt. Jack Tie brings experience from previous roles at novosound, Aqualisa Products Limited, Aquanzo and g1gabyte. Jack Tie holds a 2019 - 2023 Bachelor of Engineering - BE in Electrical and Electronics Engineering @ The University of Edinburgh.
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