Jack Tie Email
Embedded Software Engineer @ Adappt
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Jack Tie Location
- London, GB
Jack Tie Work
- 2025 -now Embedded Software Engineer @
- 2025 -2025 Embedded Software Engineer @
- 2024 -2025 Junior Electronic Engineer @
- 2023 -2024 IoT Engineer @
- 2022 -2022 Platform Engineer @
- 2021 -2022 Avionics Specialist for Endeavour @
Jack Tie Education
- The University of Edinburgh
Bachelor of Engineering - BE (Electrical and Electronics Engineering)
2019-2023
Jack Tie Summary
- Jack Tie, based in London, GB, is currently a Embedded Software Engineer at Adappt. Jack Tie brings experience from previous roles at novosound, Aqualisa Products Limited, Aquanzo and g1gabyte. Jack Tie holds a 2019 - 2023 Bachelor of Engineering - BE in Electrical and Electronics Engineering @ The University of Edinburgh. Jack Tie has 1 emails on RocketReach.
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