Jack Lieng Email & Phone Number
Wireless Firmware Engineer @ Intricon Corporation
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Jack Lieng Location
- Osseo, MN, US
Jack Lieng Work
- 2010 -now Wireless Firmware Engineer @
- 2007 -2009 Firmware and Software Engineer @
- 2004 -2007 Software Development Engineer @
Jack Lieng Education
- University of South Alabama
MS (Electrical Engineerring)
2003-2004 - St. Cloud State University
BS (Electrical Engineerring)
1999-2002
Jack Lieng Skills
- DSP
- C
- Assembly
- Firmware
- Kernel
- RTOS
- Nucleus
- Embedded Software
- Embedded Systems
- ARM
- Debugging
- Device Drivers
- Software Design
- Product Development
- Android App Developer
- Digital Signal Processors
- ZigBee
- Microcontrollers
- Electrical Engineering
- Testing
- Cache
- Hardware Architecture
- Code
- Microprocessors
- Processors
- Analog
- Electronics
- ASIC
- Reviews
- Engineers
- ARM Architecture
- Bluetooth
- Software
- Embedded Linux
- Cloud
- Embedded C
- Embedded Operating Systems
- FPGA
- PowerPC
- Real Time Operating Systems Rtos
- Design
- Software Development
- Wireless
- Logic Analyzer
- Cloud Computing
- I2c
- Hardware
- Real Time Operating Systems
Jack Lieng Summary
- Jack Lieng, based in Osseo, MN, US, is currently a Wireless Firmware Engineer at IntriCon Corp. Jack Lieng brings experience from previous roles at NMB TECHNOLOGIES CORPORATION and MENTOR GRAPHICS CORPORATION. Jack Lieng holds a 2003 - 2004 MS in Electrical Engineerring @ University of South Alabama. With a robust skill set that includes DSP, C, Assembly, Firmware, Kernel and more. Jack Lieng has 3 emails and 3 mobile phone numbers on RocketReach.
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