Jack Lieng Location

Osseo, MN, US

Jack Lieng Work

Jack Lieng Education

  • University of South Alabama

    MS (Electrical Engineerring)

    2003 - 2004
  • St. Cloud State University

    BS (Electrical Engineerring)

    1999 - 2002

Jack Lieng Skills

  • DSP
  • C
  • Assembly
  • Firmware
  • Kernel
  • RTOS
  • Nucleus
  • Embedded Software
  • Embedded Systems
  • ARM

Jack Lieng Summary

Jack Lieng, based in Osseo, MN, US, is currently a Wireless Firmware Engineer at IntriCon Corp. Jack Lieng brings experience from previous roles at NMB TECHNOLOGIES CORPORATION and MENTOR GRAPHICS CORPORATION. Jack Lieng holds a 2003 - 2004 MS in Electrical Engineerring @ University of South Alabama. With a robust skill set that includes DSP, C, Assembly, Firmware, Kernel and more. Jack Lieng has 3 emails and 3 mobile phone numbers on RocketReach.

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