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Jack Lee Location
Chengdu, Sichuan, China
Jack Lee Work
GM - North and East Asia @ (January 2021 - Present)
Project Director @ (January 2016 - December 2020)
Product Head - Wireless @ (November 2010 - December 2015)
Pre-sales Head - India @ (January 2009 - October 2010)
Pre-sales Head - Asia Pacific @ (January 2007 - December 2008)
Post-Sales Head - North China @ (January 2005 - December 2006)
Post-Sales Engineer - Northwest China @ (July 2003 - December 2004)
Jack Lee Education
University of Electronic Science and Technology of China
Bachelor of Engineering - BE (Electronic and Communications Engineering Technology)
1999-2003
Jack Lee Summary
Jack Lee, based in Chengdu, Sichuan, China, is currently a GM - North and East Asia at Maipu Communication Technology Co.,Ltd. Jack Lee brings experience from previous roles at Maipu Communication Technology Co.,Ltd and Maipu. Jack Lee holds a 1999 - 2003 Bachelor of Engineering - BE in Electronic and Communications Engineering Technology @ University of Electronic Science and Technology of China. Jack Lee has 2 emails and 2 mobile phone numbers on RocketReach.
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