Jack Glenn Email & Phone Number
SiC and IGBT Bare Die Specialist @ BorgWarner
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Jack Glenn Location
- Kokomo, IN, US
Jack Glenn Work
- SiC and IGBT Bare Die Specialist @ (March 2025 - Present)
- IC Design Team Leader @ (October 2020 - March 2025)
- Analog Circuit Designer and ASIC Team Leader @ (August 2005 - October 2020)
- Submicron and RF Device Engineering @ (January 1992 - August 2005)
Jack Glenn Education
- Purdue University
(BSEE, MSEE, Ph D, EE)
1982-1992
Jack Glenn Skills
- Six Sigma
- Engineering Management
- RF
- Analog Circuit Design
- BiCMOS
- Root Cause Analysis
- Sensors
- Analog
- Automotive
- FMEA
- Product Engineering
- Circuit Design
- CMOS
- Testing
- Design of Experiments
- RF circuits
- Failure Analysis
- Semiconductors
- Design
- SPC
- Nanotechnology
- IC
Jack Glenn Summary
- Jack Glenn, based in Kokomo, IN, US, is currently a SiC and IGBT Bare Die Specialist at BorgWarner. Jack Glenn brings experience from previous roles at BorgWarner Inc. and Delphi Automotive Systems. Jack Glenn holds a 1982 - 1992 Purdue University. With a robust skill set that includes Six Sigma, Engineering Management, RF, Analog Circuit Design, BiCMOS and more. Jack Glenn has 1 emails and 1 mobile phone numbers on RocketReach.
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