J Mennen Belonio Email & Phone Number
Senior Director IC Packaging Engineering @ Renesas Electronics
J Mennen Belonio's Location
Munich, BY, DE
J Mennen Belonio's Work
- Senior Director IC Packaging Engineering @ Renesas Electronics
- Director R and D Innovation and Engineering - IC Packaging , Module and Systems , Global Manufacturing @ Dialog Semiconductor
- Key Account Manager- EMEA @ Henkel
- Technology Manager (Global Technology Transfer IC Back End Packaging) @ Qimonda
- Process Leader R and D Innovation (Advance Wafer Level Packages Development) @ Qimonda SC300 Gmbh Co. OHG (Formerly Infineon)
- Project Leader (Package Development and Innovation) @ Infineon Technologies SC300 Gmbh & Co.OHG
- Engineering Process Leader (Back End Equipment , Process,Assembly and Manufacturing) @ CS2 Belgium
- Senior Engineer (Back End Process and Equipment Assembly) @ CS2
- Senior Field Application and Service and Customer Support Engineer @ ASM Technology Singapore
- Senior Customer Field Service Engineer @ ASA Singapore
J Mennen Belonio's Education
- Technological University of the Philippines1984 - 1989
J Mennen Belonio's Skills
- Start Ups
- Semiconductors
- Packaging
- Project Management
- Product Development
- Electronics
- Process Engineering
- Engineering Management
- FMEA
- Cross Functional Team Leadership
J Mennen Belonio's Summary
J Mennen Belonio, based in Munich, BY, DE, is currently a Senior Director IC Packaging Engineering at Renesas Electronics, bringing experience from previous roles at Dialog Semiconductor, Henkel, Qimonda and Qimonda SC300 Gmbh Co. OHG (Formerly Infineon). J Mennen Belonio holds a 1984 - 1989 Technological University of the Philippines. With a robust skill set that includes Start Ups, Semiconductors, Packaging, Project Management, Product Development and more, J Mennen Belonio contributes valuable insights to the industry. J Mennen Belonio has 3 emails on RocketReach.
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