izmomicro, a division of izmo Ltd. (NSE: IZMO), is India's premier design-to-manufacture partner specializing in System-in-Package (SiP) solutions, Silicon Photonics packaging, RF modules, and power modules. We deliver cost-effective, rapid manufacturing services for both Indian and global markets. izmomicro offers end-to-end design-to-manufacture capabilities for complex electronic and photonic systems, delivering high-performance solutions with industry-leading turnaround times. Operating in the silicon photonics market projected to reach $4.6 billion by 2027, we're at the forefront of this transformative technology. Strategic Partnership with IIT Madras izmomicro is the exclusive industry partner with IIT Madras at the Centre for Programmable Photonic Integrated Circuits and Systems (CPPICS), focusing on: • Design and packaging of programmable photonic processors • Advancing chip-scale microwave and quantum photonics applications • Creating energy-efficient system-in-package solutions Our Solutions: 1. Silicon Photonics Excellence We provide specialized expertise in photonic chip packaging with active auto-alignment, optical imaging, and custom substrate designs for applications in: • High-speed data centers and telecommunications • AI acceleration and quantum computing • Biomedical imaging and sensing 2. SiP Design & Manufacturing We deliver full-spectrum design-to-manufacture services with 2.5D and 3D packaging implementation, heterogeneous integration, and optimized solutions for performance and cost. 3. RF & Power Module Expertise Our team excels in high-frequency RF module design and power module solutions with thermal optimization for telecommunications and industrial applications. 4. Manufacturing Excellence We offer cost-effective production with Indian manufacturing advantages, rapid turnaround, and flexible manufacturing options while maintaining stringent quality control.
| Website | https://www.izmomicro.com/ |
| Employees | 42 (27 on RocketReach) |
| Industry | Semiconductor Manufacturing |
| Keywords | Ic Packaging, Custom Packaging, High Performance Packaging, Mixed Technology Assembly, System Integration, Electronic Packaging, Complex Assemblies, Design Specifications, Functional Requirements, Microelectronics Packaging, Advanced Packaging, Semiconductor Packaging, Packaging Solutions, Assembly Services, Electronics Manufacturing, Chip Packaging, Wafer Level Packaging |
| Competitors | TE Connectivity, Calix, Silicon Labs, Ubiquiti Networks, Aviat Networks, Sequans Communications, RADWIN, EnGenius Technologies, Edgewater Networks Inc., Dali Wireless +32 more (view full list) |
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Tej Soni is the President of izmo Microsystems.
27 people are employed at izmo Microsystems.