2010 -
now Sr. Director Assembly and Package Engineering @ Xilinx, Inc.
2002 -
2010 Engineering Manager @
2000 -
2002 Engineering Manager @
1995 -
2000 Engineering Manager @
1990 -
1995 Process Engineer @
Inderjit Singh Education
University Science Malaysia
BSc Applied Physics (Semiconductor Physic)
1986
-
1990
Inderjit Singh Skills
VBA Excel
Support Services
Skill Development
MEMS
Microsoft Excel
Sustaining Engineering
Processes Development
Process Engineering
Cross-functional Team Leadership
Product Engineering
Product Development
Troubleshooting
Manufacturing Operations
Statistical Process Control (SPC)
Electronics
Change Management
Manufacturing Operations Management
Quality Assurance
Project Management
Reliability
Engineering
Team Management
Semiconductors
Semiconductor Assembly Process & Package Development Management
ASIC
SoC
IC
EDA
FPGA
Verilog
Mixed Signal
Semiconductor Industry
Failure Analysis
Analog
RTL design
Engineering Management
Testing
Silicon
Manufacturing
Leadership
Semiconductor Assembly Process and Package Development Management
Software Development
Strategy
Inderjit Singh Summary
Inderjit Singh, based in Santa Clara, CA, US, is currently a Sr. Director Assembly and Package Engineering at Xilinx, Inc.. Inderjit Singh brings experience from previous roles at NVIDIA, Novalux and National Semiconductor. Inderjit Singh holds a 1986 - 1990 BSc Applied Physics in Semiconductor Physic @ University Science Malaysia. With a robust skill set that includes VBA Excel, Support Services, Skill Development, MEMS, Microsoft Excel and more. Inderjit Singh has 2 emails and 1 mobile phone numbers on RocketReach.
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