Technical Consultant (January 2017 - January 2026)
Senior Package Development Engineer @ (August 2015 - December 2016)
Senior Package Development Engineer @ (January 2006 - August 2015)
Package Design Engineer @ (January 2000 - January 2005)
Ian Talbot Education
The University of Sheffield
2i (Electronic Engineering w/ Computing)
1996-2000
Sharnbrook Upper School 1991-1996
The University of Sheffield
Ian Talbot Skills
Silicon
Semiconductors
Microelectronics
SoC
IC
Simulations
Semiconductor Industry
ASIC
Product Engineering
Mixed Signal
Electronics
Analog
CMOS
EDA
RF
Radio Frequency Rf
System On A Chip Soc
Integrated Circuits Ic
Embedded Systems
Application Specific Integrated Circuits Asic
Manufacturing
Application Specific Integrated Circuits
Integrated Circuits
Radio Frequency
System on a Chip
Ian Talbot Summary
Ian Talbot, based in Rushden, GB, is currently a Printed Circuit Board Design Engineer at BAE Systems. Ian Talbot brings experience from previous roles at BAE Systems, Freelance (Self employed), Qualcomm and Cambridge Silicon Radio (CSR) Plc.. Ian Talbot holds a 1996 - 2000 2i in Electronic Engineering w/ Computing @ The University of Sheffield. With a robust skill set that includes Silicon, Semiconductors, Microelectronics, SoC, IC and more. Ian Talbot has 2 emails on RocketReach.
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