RF Engineer @ Thomson Electronic (January 1990 - January 1998)
Hung Lai Education
Rochester Institute of Technology
BS (Electrical Engineer)
1985-1990
Hung Lai Skills
Product Development
Analog
PCB design
Telecommunications
Satellite Communications
Electronics
RF
Wireless
System Design
Testing
Satellite
Product Management
Systems Engineering
Consumer Electronics
System Architecture
Hung Lai Summary
Hung Lai, based in Rochester, NY, US, is currently a Hardware Engineer at Comtech Mobile Data Com. Hung Lai brings experience from previous roles at Comtech Mobile Datacom Corporation, Comtech Mobile Datacom, Comtech and Thomson. Hung Lai holds a 1985 - 1990 BS in Electrical Engineer @ Rochester Institute of Technology. With a robust skill set that includes Product Development, Analog, PCB design, Telecommunications, Satellite Communications and more. Hung Lai has 1 emails and 1 mobile phone numbers on RocketReach.
Looking for a different Hung Lai?
Find contact details for 700 million professionals.