Hung Lai Location
Rochester, NY, US
Hung Lai Work
Hung Lai Education
Hung Lai Skills
Hung Lai Summary
Hung Lai, based in Rochester, NY, US, is currently a Hardware Engineer at Comtech Mobile Data Com. Hung Lai brings experience from previous roles at Comtech Mobile Datacom Corporation, Comtech Mobile Datacom, Comtech and Thomson. Hung Lai holds a 1985 - 1990 BS in Electrical Engineer @ Rochester Institute of Technology. With a robust skill set that includes Product Development, Analog, PCB design, Telecommunications, Satellite Communications and more. Hung Lai has 3 emails and 1 mobile phone numbers on RocketReach.