CCD Process Integration and Implant and PVD @ Truesense Imaging, Inc. (December 2011 - August 2015)
CCD and CMOS Pixel Design and TCAD and Process Integration and Implant @ (September 1996 - December 2011)
Fab Process and Product Engineer @ (January 1991 - January 1996)
Hung Doan Education
University at Buffalo
MS (Electrical Engineering)
1990-1991
Rochester Institute of Technology
BS (Microelectronic Engineering)
1985-1990
Hung Doan Summary
Hung Doan, based in Rochester, NY, US, is currently a Pixel Design (TCAD and Layout and Characterization) at Sony Electronics. Hung Doan brings experience from previous roles at ON Semiconductor, Truesense Imaging, Inc., Eastmant Kodak Company and Advanced Micro Devices. Hung Doan holds a 1990 - 1991 MS in Electrical Engineering @ University at Buffalo. Hung Doan has 1 emails on RocketReach.
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