Chief Technology Officer, Co-founder @ Ampcera Inc.
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Hui du Location
Tucson, AZ, US
Hui du Work
2017 -
now Chief Technology Officer, Co-founder @
2024 -
now Board Member, Co-founder @
2014 -
2024 President, Co-founder @
2014 -
2017 Manager, Ionic Conductive Materials Department @ Sion Power
2013 -
2014 Sr. Research Scientist @ Sion Power
2011 -
2012 Sr. CVD Process Engineer @
2010 -
2011 Postdoc @
2009 -
2010 Postdoctoral Research Associate @
2003 -
2003 Graduate Researcher @
1999 -
2002 Graduate Researcher and Research Staff @ Shanghai Institute of Ceramics Chinese Academy of Sciences
Hui du Education
Carnegie Mellon University
Ph. D, Materials Science and Engineering (Materials Science and Engineering)
2004
-
2009
Clemson University
M.S, Material Science and Engineering (Material Science and Engineering)
2003
-
2003
Shanghai Institute of Ceramics, Chinese Academy of Sciences
M.S (Material Science and Engineering)
1999
-
2002
Zhengzhou University
Bechelor's (Materials Science and Engineering)
1995
-
1999
Hui du Skills
Thin Films
AFM
Powder X-ray Diffraction
Characterization
CVD
PVD
ALD
Sputtering
Materials Science
Semiconductors
TEM
XPS
Scanning Electron Microscopy
Solar Cells
PECVD
Photovoltaics
Raman
Atomic Layer Deposition
Metrology
Plasma Physics
SEM
XRF
Surface Chemistry
Physics
Nanotechnology
FIB
UHV
EDX
Dielectrics
Combinatorial Chemistry
Ferroelectrics
Coatings
Ceramic Processing
Ellipsometry
Etching
PEALD
Coating
high vacuum
device physics
XRD
UHV system
Surface Science
RHEED, LEED
Electrochemistry
Batteries
organic-inorganic composite
Design of Experiments
Materials
Surface
Organic Inorganic Composite
Powder X Ray Diffraction
Engineering
Data Analysis
Rheed
LEED
Microsoft Word
Hui du Summary
Hui du, based in Tucson, AZ, US, is currently a Chief Technology Officer, Co-founder at Ampcera Inc.. Hui du brings experience from previous roles at MSE Supplies and Sion Power. Hui du holds a 2004 - 2009 Ph. D, Materials Science and Engineering in Materials Science and Engineering @ Carnegie Mellon University. With a robust skill set that includes Thin Films, AFM, Powder X-ray Diffraction, Characterization, CVD and more. Hui du has 5 emails and 3 mobile phone numbers on RocketReach.
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