Hui Cheng Email & Phone Number
Head of Coupang Robotics and Automation @ Coupang
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Hui Cheng Location
- United States
Hui Cheng Work
- Head of Coupang Robotics and Automation @ (July 2022 - Present)
- Corporate Vice President, Chief Scientist @ Seedland Group (April 2020 - May 2022)
- Board Member @ (March 2019 - April 2020)
- Head, JD-X RDC @ (February 2017 - April 2020)
- Sr. Manager of Research, CV and ML @ (May 2016 - January 2017)
- Program Director @ (December 2000 - May 2016)
- Member of Technical Staff @ (July 1999 - December 2000)
Hui Cheng Education
- Purdue University
Hui Cheng Skills
- R&D
- Technological Innovation
- Machine Vision
- Program Management
- Technical Marketing
- Signal Processing
- Computer Vision
- Image Analysis
- Video Analytics
- Social Media
- Data Analysis
- Artificial Intelligence
- Systems Engineering
- Sensors
- Algorithms
- Engineering Management
- Image Processing
- Research and Development (R
- Machine Learning
- C
- Software Development
- Computer Science
- Project Management
- Change Management
- Management
- Research and Development R
- Research and Development
Hui Cheng Summary
- Hui Cheng, based in United States, is currently a Head of Coupang Robotics and Automation at Coupang. Hui Cheng brings experience from previous roles at Seedland Group, Kindred AI, JD.COM and Amazon. Hui Cheng holds a Purdue University. With a robust skill set that includes R&D, Technological Innovation, Machine Vision, Program Management, Technical Marketing and more. Hui Cheng has 1 emails and 2 mobile phone numbers on RocketReach.
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