Hua-Wei Ko Location
United States
Hua-Wei Ko Work
Hua-Wei Ko Education
University of Illinois at Urbana-Champaign
Doctor of Philosophy - PhD (Mechanical Engineering)
2014 - 2019
National Taiwan University
Master of Science - MS (Mechanical Engineering)
2010 - 2012
National Chiao Tung University
Bachelor of Science - BS (Mechanical Engineering)
2006 - 2010
Hua-Wei Ko Summary
Hua-Wei Ko, based in United States, is currently a Package R and D Engineer at Intel Corporation. Hua-Wei Ko brings experience from previous roles at Caterpillar Inc., University of Illinois at Urbana-Champaign and National Taiwan University. Hua-Wei Ko holds a 2014 - 2019 Doctor of Philosophy - PhD in Mechanical Engineering @ University of Illinois at Urbana-Champaign. Hua-Wei Ko has 4 emails on RocketReach.