Hsiu-Ping Wei Email & Phone Number
IC Packaging Engineer @ Apple
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Hsiu-Ping Wei Location
- San Jose, CA, US
Hsiu-Ping Wei Work
- 2018 -now IC Packaging Engineer @
- 2013 -2018 PHD Student @ University of Maryland, College Park - Mechanical Engineering Department
- 2012 -2013 Patent Engineer @ Louis International Patent Office
- 2008 -2011 Senior R and D Engineer @
- 2007 -2008 2nd Lieutenant Platoon Leader @ Military Supplies Reserve Center, Army of R.O.C.
Hsiu-Ping Wei Education
- 美國馬里蘭大學派克分校
Doctor of Philosophy - PhD (Mechanical Engineering)
2013-2018 - National Tsing Hua University
Master of Science (MS) (Power Mechanical Engineering)
2005-2007 - National Tsing Hua University
BS (Power Mechanical Engineering)
2000-2005
Hsiu-Ping Wei Skills
- Semiconductor Packaging
- Optics
- Sensors
- Semiconductors
- Patent Applications
- Research
- Simulations
- Patent Searching
- ANSYS
- Semiconductor Process
- Patents
- Invention
- R&d
- Patent Prosecution
- Numerical Simulation
- Reliability
Hsiu-Ping Wei Summary
- Hsiu-Ping Wei, based in San Jose, CA, US, is currently a IC Packaging Engineer at 美商蘋果電腦股份有限公司. Hsiu-Ping Wei brings experience from previous roles at University of Maryland, College Park - Mechanical Engineering Department, Louis International Patent Office, TSMC and Military Supplies Reserve Center, Army of R.O.C.. Hsiu-Ping Wei holds a 2013 - 2018 Doctor of Philosophy - PhD in Mechanical Engineering @ 美國馬里蘭大學派克分校. With a robust skill set that includes Semiconductor Packaging, Optics, Sensors, Semiconductors, Patent Applications and more. Hsiu-Ping Wei has 1 emails and 1 mobile phone numbers on RocketReach.
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