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Hongyan Location
Mickleton, NJ, US
Hongyan Work
2024 -now Sr. Firmware Engineer @
2023 -now Firmware Engineer @
2021 -2023 Program Manager @
2019 -2021 Project Manager, PMP @
2011 -2021 Sr. Embedded Software Engineer, PMP @ Crane Payment Innovations (formly known as MEI)
2001 -2011 Embedded Software Engineer @
1998 -2001 Software and Hardware Engineer @
1992 -1995 Software and Hardware Engineer @ GTM-STEELLEX Medical Instrument Corporation , Beijing, China
Hongyan Education
Drexel University
M.S Degree (Biomedical Engineering)
1995-1998
Capital Institute of Medicine
B.S. Degree (Biomedical Engineering)
1987-1992
Hongyan Summary
Hongyan, based in Mickleton, NJ, US, is currently a Sr. Firmware Engineer at Impulse Dynamics. Hongyan brings experience from previous roles at Impulse Dynamics, Crane Payment Innovations and Crane Payment Innovations (formly known as MEI). Hongyan holds a 1995 - 1998 M.S Degree in Biomedical Engineering @ Drexel University. Hongyan has 2 emails and 2 mobile phone numbers on RocketReach.
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