Herve Daniel Email
Imaging Hw Architect @ Huawei
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Herve Daniel Location
- Nice, FR
Herve Daniel Work
- Imaging Hw Architect @ (May 2013 - Present)
- Graphics and Multimedia Architect @ Texas Instruments (January 2010 - Present)
- Architecture and Design Lead @ Texas Instruments (January 2007 - January 2010)
- Architecture and Digital Design @ Texas Instruments (January 1999 - January 2004)
Herve Daniel Education
- Polytechnique Montréal
Masters (Electronics Engineering)
1996-1997
Herve Daniel Skills
- ASIC
- Application-Specific Integrated Circuits (ASIC)
- Benchmarking
- Collaborative Leadership
- Debugging
- Decision-Making
- Digital Signal Processors
- Formal Verification
- Hardware Architecture
- IC
- Integrated Circuit Design
- Integrated Circuits (IC)
- Low-power Design
- OpenGL ES
- Organization Skills
- Power Management
- Processors
- RTL Design
- RTL coding
- Semiconductors
- SoC
- System on a Chip (SoC)
- Time Management
- VHDL
- VLSI
- Very-Large-Scale Integration (VLSI)
- Wireless
- Wireless Technologies
Herve Daniel Summary
- Herve Daniel, based in Nice, FR, is currently a Imaging Hw Architect at Huawei Technologies. Herve Daniel brings experience from previous roles at Texas Instruments. Herve Daniel holds a 1996 - 1997 Masters in Electronics Engineering @ Polytechnique Montréal. With a robust skill set that includes ASIC, Application-Specific Integrated Circuits (ASIC), Benchmarking, Collaborative Leadership, Debugging and more. Herve Daniel has 2 emails on RocketReach.
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