Heidi Ho Email & Phone Number
IC Packaging Engineer @ Apple
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Heidi Ho Location
- California, United States
Heidi Ho Work
- 2017 -now IC Packaging Engineer @
- 2014 -2017 Sr. Engineer, IC Package Technology Integration @
- 2011 -2014 IC Packaging Thermal Engineer @
- 2010 -2010 Engineering Intern @
- 2008 -2009 Undergraduate Researcher in Bio-Fluid Dynamics @ Fluid Dynamic Lab, Mechanical Engineering, National Central University, Taiwan
Heidi Ho Education
- University of California, San Diego
M.S. (Mechanical Engineering)
2009-2011 - National Central University, Taiwan
B.S. (Mechanical Engineering)
2005-2009
Heidi Ho Skills
- Thermal Analysis
- Icepak
- Matlab
- Hypermesh
- AutoCAD
- Solidworks
- Electronics Packaging
- R&D
- CFDesign
- Fluid Mechanics
- Heat Transfer
- Solid Mechanics
- Design of Experiments
- Thermal Testing
- ANSYS Mechanical
- ANSYS
- IC
- Thermal
- Simulations
- Technology
- C
- Electronics
- Engineering
- Integrated Circuits Ic
- Testing
- Manufacturing
- Technology Integration
- Semiconductors
- Integration
- CFD
- Integrated Circuits
Heidi Ho Summary
- Heidi Ho, based in California, United States, is currently a IC Packaging Engineer at Apple. Heidi Ho brings experience from previous roles at Micron Technology, Broadcom Limited, Inventec Appliances Corp and Fluid Dynamic Lab, Mechanical Engineering, National Central University, Taiwan. Heidi Ho holds a 2009 - 2011 M.S. in Mechanical Engineering @ University of California, San Diego. With a robust skill set that includes Thermal Analysis, Icepak, Matlab, Hypermesh, AutoCAD and more. Heidi Ho has 2 emails and 1 mobile phone numbers on RocketReach.
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