Heidi Ho Location
California, United States
Heidi Ho Work
Heidi Ho Education
University of California, San Diego
M.S. (Mechanical Engineering)
2009 - 2011
National Central University, Taiwan
B.S. (Mechanical Engineering)
2005 - 2009
Heidi Ho Skills
Heidi Ho Summary
Heidi Ho, based in California, United States, is currently a IC Packaging Engineer at Apple. Heidi Ho brings experience from previous roles at Micron Technology, Broadcom Limited, Inventec Appliances Corp and Fluid Dynamic Lab, Mechanical Engineering, National Central University, Taiwan. Heidi Ho holds a 2009 - 2011 M.S. in Mechanical Engineering @ University of California, San Diego. With a robust skill set that includes Thermal Analysis, Icepak, Matlab, Hypermesh, AutoCAD and more. Heidi Ho has 3 emails and 1 mobile phone numbers on RocketReach.