Heidi Ho Email & Phone Number
IC Packaging Engineer @ Apple
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Heidi Ho Location
- California, United States
Heidi Ho Work
- IC Packaging Engineer @ (April 2017 - Present)
- Sr. Engineer, IC Package Technology Integration @ (December 2014 - April 2017)
- IC Packaging Thermal Engineer @ (May 2011 - November 2014)
- Engineering Intern @ (July 2010 - August 2010)
- Undergraduate Researcher in Bio-Fluid Dynamics @ Fluid Dynamic Lab, Mechanical Engineering, National Central University, Taiwan (January 2008 - July 2009)
Heidi Ho Education
- UC San Diego
M.S. (Mechanical Engineering)
2009-2011 - National Central University, Taiwan
B.S. (Mechanical Engineering)
2005-2009
Heidi Ho Skills
- Thermal Analysis
- Icepak
- Matlab
- Hypermesh
- AutoCAD
- Solidworks
- Electronics Packaging
- R&D
- CFDesign
- Fluid Mechanics
- Heat Transfer
- Solid Mechanics
- Design of Experiments
- Thermal Testing
- ANSYS Mechanical
- ANSYS
- IC
- Thermal
- Simulations
- C
- CFD
- Electronics
- Engineering
- Integrated Circuits (IC)
- Semiconductors
- Testing
- Technology
- Integrated Circuits Ic
- Manufacturing
- Technology Integration
- Integration
- Integrated Circuits
Heidi Ho Summary
- Heidi Ho, based in California, United States, is currently a IC Packaging Engineer at Apple. Heidi Ho brings experience from previous roles at Micron Technology, Broadcom Limited, Inventec Appliances Corp and Fluid Dynamic Lab, Mechanical Engineering, National Central University, Taiwan. Heidi Ho holds a 2009 - 2011 M.S. in Mechanical Engineering @ UC San Diego. With a robust skill set that includes Thermal Analysis, Icepak, Matlab, Hypermesh, AutoCAD and more. Heidi Ho has 3 emails and 1 mobile phone numbers on RocketReach.
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