Heather Pierre's Location
Harrisburg, Pennsylvania, United States
Heather Pierre's Work
- Senior Packaging Engineer @ The Hershey Company
- Packaging Engineer @ Elmer's Products, Inc.
Heather Pierre's Education
- Rochester Institute of Technology2002 - 2007
Heather Pierre's Skills
- Product Innovation
- Food Packaging
- Product Development
- FMCG
- Lean Manufacturing
- Cross Functional Team Leadership
- Consumer Products
- Packaging Engineering
- Continuous Improvement
- Design of Experiments
Heather Pierre's Summary
Heather Pierre, based in Harrisburg, Pennsylvania, United States, is currently a Senior Packaging Engineer at The Hershey Company, bringing experience from previous roles at Elmer's Products, Inc.. Heather Pierre holds a 2002 - 2007 Rochester Institute of Technology. With a robust skill set that includes Product Innovation, Food Packaging, Product Development, FMCG, Lean Manufacturing and more, Heather Pierre contributes valuable insights to the industry. Heather Pierre has 2 emails on RocketReach.
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