He-Wei Yu Email
Principal Engineer @ TSMC
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He-Wei Yu Location
- Tainan, Tainan City, TW
He-Wei Yu Work
- Principal Engineer @ (July 2022 - Present)
- Senior Process Engineer @ (July 2016 - Present)
- Process Engineer @ (May 2013 - June 2016)
He-Wei Yu Education
- National Cheng Kung University
Master's degree (Chemical Engineering)
2010-2012 - National Cheng Kung University
Bachelor's degree (Chemical engineering)
2006-2010 - The Affiliated Senior High School of National Kaohsiung Normal University 2003-2006
He-Wei Yu Skills
- 3DIC TSV Technology
- 8D Problem Solving
- Assembly Processes
- Bump
- Carrier bonding
- Chemical Engineering
- CoWoS
- Cross Functional Team Building
- Defect Identification
- Defect Tracking
- Defense
- Design of Experiments
- Diodes
- EDA
- Failure Analysis
- Flip Chip
- InFO
- Lithography
- Micro bump
- Packaging Engineering
- Process Control
- Process Engineering
- Process Improvement
- Root Cause Analysis
- Semiconductor Fabrication
- Surface Analysis
- WLCSP
- Wafer Cleaning
- Wafer Fab
- 半導體
- 統計流程管制 (SPC)
- 製造
He-Wei Yu Summary
- He-Wei Yu, based in Tainan, Tainan City, TW, is currently a Principal Engineer at 台灣積體電路製造股份有限公司. He-Wei Yu brings experience from previous roles at 台灣積體電路製造股份有限公司. He-Wei Yu holds a 2010 - 2012 Master's degree in Chemical Engineering @ National Cheng Kung University. With a robust skill set that includes 3DIC TSV Technology, 8D Problem Solving, Assembly Processes, Bump, Carrier bonding and more. He-Wei Yu has 1 emails on RocketReach.
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