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Hayden Moline Location
Eau Claire, WI, US
Hayden Moline Work
Product Development Engineer @ (June 2026 - Present)
Packaging Engineering Manager @ (August 2025 - June 2026)
Packaging Engineering Supervisor @ (March 2023 - June 2026)
Senior Packaging Engineer @ (July 2022 - June 2026)
Packaging Engineer @ (February 2021 - July 2022)
Student @ (September 2016 - February 2021)
R and D Packaging Intern @ (May 2019 - September 2019)
R and D Intern @ (May 2018 - December 2018)
Hayden Moline Education
UW-Stout Polytechnic
Bachelor of Science - BS (Packaging Science)
2016-2020
Hayden Moline Skills
Microsoft Office
Customer Service
Microsoft Excel
Leadership
Microsoft Word
Microsoft PowerPoint
Public Speaking
SolidWorks
AutoCAD
ArtiosCAD
TOPS
Teamwork
Microsoft Project
Mircrosoft Excel
Critical Thinking
Hayden Moline Summary
Hayden Moline, based in Eau Claire, WI, US, is currently a Product Development Engineer at Tosca. Hayden Moline brings experience from previous roles at Lippert and CURT Group. Hayden Moline holds a 2016 - 2020 Bachelor of Science - BS in Packaging Science @ UW-Stout Polytechnic. With a robust skill set that includes Microsoft Office, Customer Service, Microsoft Excel, Leadership, Microsoft Word and more. Hayden Moline has 1 emails and 2 mobile phone numbers on RocketReach.
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