Harold Wu Email
Technical Manager @ MediaTek
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Harold Wu Location
- Hsinchu, TW
Harold Wu Work
- Technical Manager @ (January 2022 - Present)
- Staff Package Engineer @ (July 2021 - January 2022)
- Technical Deputy Manager @ (September 2019 - July 2021)
- Staff Engineer @ (June 2009 - August 2019)
- Engineer @ (May 2008 - June 2009)
Harold Wu Education
- Chang Gung University
Master's degree (Mechanical Engineering)
2004-2006 - Chang Gung University
Bachelor's degree (Mechanical Engineering)
2000-2004
Harold Wu Skills
- Semiconductors
- IC packaging
- CAE
- ANSYS
- Hyperworks
- Icepak
- Stress Analysis
Harold Wu Summary
- Harold Wu, based in Hsinchu, TW, is currently a Technical Manager at 聯發科. Harold Wu brings experience from previous roles at OmniVision Technologies, Inc., 智原科技, 聯華電子股份有限公司 and Wistron. Harold Wu holds a 2004 - 2006 Master's degree in Mechanical Engineering @ Chang Gung University. With a robust skill set that includes Semiconductors, IC packaging, CAE, ANSYS, Hyperworks and more. Harold Wu has 1 emails on RocketReach.
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