What if you knew the temperature profile inside your chip—before tapeout? Today’s high performance chips have areas with very high power density, causing temperature to rise unevenly within the die. Gradient’s thermal simulator produces a full-chip, three-dimensional temperature profile at device- and interconnect-level resolution. Instance-specific temperatures are annotated into your netlist, giving you thermally-accurate electrical analysis. The designer can pinpoint hotspots and excessive temperature variations—and avoid thermally-induced circuit failures, performance degradations, and reliability issues—before building the chip.
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Gradient Design Automation Questions
The Gradient Design Automation annual revenue was $21.6 million in 2026.
1 people are employed at Gradient Design Automation.
Gradient Design Automation is based in Cambridge, Massachusetts.
The NAICS codes for Gradient Design Automation are [423, 54, 541, 4234, 42343, 42].
The SIC codes for Gradient Design Automation are [504, 50, 873, 87].
