Gokul Kumar's Location
United States
Gokul Kumar's Work
- Director - Package Development and Engineering @ Micron Technology
- Senior Manager - Package Design @ Micron Technology
- Principal Engineer @ Western Digital
- Staff Packaging Engineer @ SanDisk®
- Senior Packaging Engineer @ SanDisk®
- Technical Program Manager - 3D integration and embedded die @ Georgia Institute of Technology
- Engineering @ Qualcomm
- Assistant Systems Engineer @ Tata Consultancy Services
- Electrical Engineering @ HCL America, Inc.
Gokul Kumar's Education
- Anna University
Bachelor of Engineering (B.E.) (Electrical, Electronics and Communications Engineering)
- Georgia Institute of Technology
PhD (Electrical and Computer Engineering)
- Georgia Tech
Master of Science (Electrical and computer engineering)
Gokul Kumar's Skills
- Electrical Design and Modelling
- Microsystems Packaging
- Characterization
- Testing
- Manufacturing
- Simulations
- SPICE
- Ansys HFSS
- Agilent ADS
- Sonnet
Gokul Kumar's Summary
Gokul Kumar, based in United States, is currently a Director - Package Development and Engineering at Micron Technology, bringing experience from previous roles at Micron Technology, Western Digital and SanDisk, a Western Digital Brand. Gokul Kumar holds a Bachelor of Engineering (B.E.) in Electrical, Electronics and Communications Engineering @ Anna University. With a robust skill set that includes Electrical Design and Modelling, Microsystems Packaging, Characterization, Testing, Manufacturing and more, Gokul Kumar contributes valuable insights to the industry. Gokul Kumar has 3 emails and 1 mobile phone number on RocketReach.
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