Gang Wei Email & Phone Number
Vice President Global Engineering @ Visteon Corporation
5 free lookup(s).
If you need more lookups,
subscriptions start at $34 USD/month.
Gang Wei Location
- Cupertino, CA, US
Gang Wei Work
- Vice President Global Engineering @ (June 2022 - Present)
- CTO Global Engineering - Smart Energy Business Group @ (January 2018 - June 2022)
- Senior AVP - IoT and RF Microwave Products @ (January 2011 - December 2017)
- VP of Engineering - RF Antenna Module Products @ (April 2005 - November 2010)
- Engineering Director - Broadband Communication Products @ (April 2004 - April 2005)
- Technical Manager and MTS - V.90 Modem, xDSL, WiFi Chipset @ (July 1994 - April 2004)
Gang Wei Education
- Illinois Institute of Technology
Master of Science (Electrical Engineering)
Gang Wei Skills
- RF
- Antennas
- Business Strategy
- Cross-functional Team Leadership
- Electronics Technology
- Electronics
- Embedded Systems
- Product Management
- Radio Frequency (RF)
- Strategic Technology Development
- Conferences
- Digital Imaging
- Medical Devices
- Hard Drives
- Forecasting
- Analog
- Offshore
- Computing
- Stroke
- C
- Instrumental
- MIPS
- Expedite
- Capex
- OEMs
- Mergers and Acquisitions
- Milestone
- Roadmap
- Revenue
- Metals
- Budgets
- Academic
- Introducing
- Financial Structuring
- Charging
- Windows
- Third Party Applications
- SOW
- Microprocessors
- Business Partnering
- Agreement
- Engineering
- Quality System
- Oversight
- Applications
- Integration
- ANSYS
- Data Transfer
- Business Development
- Consumer Electronics
- Contract Management
- Gold
- Driving
- Design
- Noise
- ISO 13485
- Internal Communications
- Jersey
- Signal
- Cell
- Communication
- Product Application
- Ecosystem
- Chicago
- Dell Computers
- Profit
- PTC Creo
- WLAN
- VoIP
- TCP/IP
- Test Automation
- Key Performance Indicators
- Finance
- Life Style
- Strategy
- Infrastructure
- Shanghai
- Networking
- Strategies
- Cost Efficiency
- CRM
- IEEE
- Executive Profile
- Patents
- Detection
- Electric Vehicles
- Intellectual Property
- Ultra
- Consumer
- Human Resources
- Budgeting
- Research
- Accounting System
- ODM
- PPAP
- Performance Improvement
- Magazines
- Wireless
- Modular
- Automotive
- Network Communications
- On Budget
- Solution
- Pragmatic
- Cross Functional Team Leadership
- APIs
- Negotiation
- Gaps
- DSL
- Exploring
- Redcine X
- Suppliers
- Legal
- System Architecture
- Acquisitions
- Intellectual
- China
- Prototype
- Chipset
- Speech
- Stage
- Open Source
- Data Sheets
- PFMEA
- Design Review
- Cellular Communications
- Chain
- SQL
- Software
- Export
- Active
- Leadership
- Line Management
- Iso Implementation
- Engineering Design
- Project Management
- Tactical Planning
- Microwave
- WINS
- Team Orientation
- Architecture
- Zero Defects
- Local Area Network
- Radio Frequency Rf
- Operations
- Sourcing
- Fin
- Process Flow
- Manufacturing
- Testing
- Working Experience
- Marketing
- Core Technology
- Concurrent
- 802.11a
- Bluetooth
- Siemens
- Home
- Yield
- Diabetes
- Imp
- San Jose
- Oracle Enterprise Manager
- Compelling
- Design for Manufacturing
- Firmware
- SPC
- Satellite
- Nokia
- Module Design
- Art
- OFDM
- NDA
- Digital Signal Processors
- Usa
- Platforms
- Cost Management
- Alcatel
- Cisco Technologies
- Asia Pacific
- Linux
- Linksys
- Pda
- Discrete
- Diligent
- Application Notes
- Incubation
- Laser
- Directions
- Chip
- Microelectronics
- GUI
- Texas
- Responsibility
- Internet Protocols
- Conceptual Modeling
- Nano
- Investments
- Cost
- Strategic Partnerships
- NEC
- Matlab
- Gateway
- Facilities Management
- Engineering Leadership
- Sony
- Validation
- Mechanism
- Dmt
- Chrysler
- Monitors
- Portfolio Management
- Ford
- IOT
- DFMEA
- PMA
- Samsung
- Players
- Electronic Products
- Broadband
- Simple
- Technology Integration
- Focal Point
- Assembly
- Commodities
- Accounting
- ARM
- Competitive Analysis
- Social Influence
- Glucose
- 50m
- Lean Manufacturing
- Huawei
- Analysis
- SIP
- Digital Signal Processing
- Six Sigma
- Structure
- Home Video
- Revenue and Profit Growth
- R&d
- Sales
- Wireless Broadband
- Respiration
- Healthcare
- Hardware
- Cables
- Margin Improvement
- Market
- FIX Protocol
- Protocol Stacks
- APQP
- Management
- CIP
- Motorola
- Connectivity
- Business Planning
- Organic Chemistry
- Mechanical
- Process Simulation
- Reviews
- WiFi
- Return on Investment
- Printers
- Taiwan
- Power
- Positioning
- Mts
- Circuit
- ATM networks
- ISO/TS 16949
- Product Marketing
- Intelligent Agents
- P&l
- Software Development
- Electro Mechanical
- Pricing
- Interconnect
- Hong Kong
- Product Development
- Bmw
- Low Energy
- Sphere
- Capital
- Korea
- System
- Automation
- Ericsson
- MSA
- Collaterals
- Short
- Shark
- Realization
- Insulin
- Radio Frequency
Gang Wei Summary
- Gang Wei, based in Cupertino, CA, US, is currently a Vice President Global Engineering at Visteon Corporation. Gang Wei brings experience from previous roles at Honeywell, Foxconn, Laird Performance Materials and Texas Instruments. Gang Wei holds a Master of Science in Electrical Engineering @ Illinois Institute of Technology. With a robust skill set that includes RF, Antennas, Business Strategy, Cross-functional Team Leadership, Electronics Technology and more. Gang Wei has 2 emails and 3 mobile phone numbers on RocketReach.
Looking for a different Gang Wei?
Find contact details for 700 million professionals.
Others Named Gang Wei
Gang Wei
Vice President Global Engineering
Cupertino, CA, US
Zhi-Gang Wei
Technology Architect
The Hague, ZH, NL
Top Visteon Corporation Employees
Bill Santos
Head of Global Electrical Engineering
Belleville, MI, US
Uday Dodla
Vice President of Product Management
Bengaluru, KA, IN
Bob V
Senior Vice President
Holland, Michigan, United States
Kristin Trecker
Chief People Officer
Tucson, AZ, US
Subhash Balagatte
Vice President, Engineering Programs
Detroit, MI, US
Colleen Myers
Vice President, Chief Accounting Officer
Detroit, MI, US
G2 Crowd Trusted
300K+ Plugin Users
© 2026 RocketReach.co