Gang Wei Email & Phone Number
Vice President Global Engineering @ Visteon Corporation
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Gang Wei Location
- Cupertino, CA, US
Gang Wei Work
- 2022 -now Vice President Global Engineering @
- 2018 -2022 CTO Global Engineering - Smart Energy Business Group @
- 2011 -2017 Senior AVP - IoT and RF Microwave Products @
- 2005 -2010 VP of Engineering - RF Antenna Module Products @
- 2004 -2005 Engineering Director - Broadband Communication Products @
- 1994 -2004 Technical Manager and MTS - V.90 Modem, xDSL, WiFi Chipset @
Gang Wei Education
- Illinois Institute of Technology
Gang Wei Skills
- RF
- Antennas
- Business Strategy
- Cross-functional Team Leadership
- Electronics Technology
- Electronics
- Embedded Systems
- Product Management
- Radio Frequency (RF)
- Strategic Technology Development
- Conferences
- Digital Imaging
- Medical Devices
- Hard Drives
- Forecasting
- Analog
- Offshore
- Computing
- Stroke
- C
- Instrumental
- MIPS
- Expedite
- Capex
- OEMs
- Mergers and Acquisitions
- Milestone
- Roadmap
- Revenue
- Metals
- Budgets
- Academic
- Introducing
- Financial Structuring
- Charging
- Windows
- Third Party Applications
- SOW
- Microprocessors
- Business Partnering
- Agreement
- Engineering
- Quality System
- Oversight
- Applications
- Integration
- ANSYS
- Data Transfer
- Business Development
- Consumer Electronics
- Contract Management
- Gold
- Driving
- Design
- Noise
- ISO 13485
- Internal Communications
- Jersey
- Signal
- Cell
- Communication
- Product Application
- Ecosystem
- Chicago
- Dell Computers
- Profit
- PTC Creo
- WLAN
- VoIP
- TCP/IP
- Test Automation
- Key Performance Indicators
- Finance
- Life Style
- Strategy
- Infrastructure
- Shanghai
- Networking
- Strategies
- Cost Efficiency
- CRM
- IEEE
- Executive Profile
- Patents
- Detection
- Electric Vehicles
- Intellectual Property
- Ultra
- Consumer
- Human Resources
- Budgeting
- Research
- Accounting System
- ODM
- PPAP
- Performance Improvement
- Magazines
- Wireless
- Modular
- Automotive
- Network Communications
- On Budget
- Solution
- Pragmatic
- Cross Functional Team Leadership
- APIs
- Negotiation
- Gaps
- DSL
- Exploring
- Redcine X
- Suppliers
- Legal
- System Architecture
- Acquisitions
- Intellectual
- China
- Prototype
- Chipset
- Speech
- Stage
- Open Source
- Data Sheets
- PFMEA
- Design Review
- Cellular Communications
- Chain
- SQL
- Software
- Export
- Active
- Leadership
- Line Management
- Iso Implementation
- Engineering Design
- Project Management
- Tactical Planning
- Microwave
- WINS
- Team Orientation
- Architecture
- Zero Defects
- Local Area Network
- Radio Frequency Rf
- Operations
- Sourcing
- Fin
- Process Flow
- Manufacturing
- Testing
- Working Experience
- Marketing
- Core Technology
- Concurrent
- 802.11a
- Bluetooth
- Siemens
- Home
- Yield
- Diabetes
- Imp
- San Jose
- Oracle Enterprise Manager
- Compelling
- Design for Manufacturing
- Firmware
- SPC
- Satellite
- Nokia
- Module Design
- Art
- OFDM
- NDA
- Digital Signal Processors
- Usa
- Platforms
- Cost Management
- Alcatel
- Cisco Technologies
- Asia Pacific
- Linux
- Linksys
- Pda
- Discrete
- Diligent
- Application Notes
- Incubation
- Laser
- Directions
- Chip
- Microelectronics
- GUI
- Texas
- Responsibility
- Internet Protocols
- Conceptual Modeling
- Nano
- Investments
- Cost
- Strategic Partnerships
- NEC
- Matlab
- Gateway
- Facilities Management
- Engineering Leadership
- Sony
- Validation
- Mechanism
- Dmt
- Chrysler
- Monitors
- Portfolio Management
- Ford
- IOT
- DFMEA
- PMA
- Samsung
- Players
- Electronic Products
- Broadband
- Simple
- Technology Integration
- Focal Point
- Assembly
- Commodities
- Accounting
- ARM
- Competitive Analysis
- Social Influence
- Glucose
- 50m
- Lean Manufacturing
- Huawei
- Analysis
- SIP
- Digital Signal Processing
- Six Sigma
- Structure
- Home Video
- Revenue and Profit Growth
- R&d
- Sales
- Wireless Broadband
- Respiration
- Healthcare
- Hardware
- Cables
- Margin Improvement
- Market
- FIX Protocol
- Protocol Stacks
- APQP
- Management
- CIP
- Motorola
- Connectivity
- Business Planning
- Organic Chemistry
- Mechanical
- Process Simulation
- Reviews
- WiFi
- Return on Investment
- Printers
- Taiwan
- Power
- Positioning
- Mts
- Circuit
- ATM networks
- ISO/TS 16949
- Product Marketing
- Intelligent Agents
- P&l
- Software Development
- Electro Mechanical
- Pricing
- Interconnect
- Hong Kong
- Product Development
- Bmw
- Low Energy
- Sphere
- Capital
- Korea
- System
- Automation
- Ericsson
- MSA
- Collaterals
- Short
- Shark
- Realization
- Insulin
- Radio Frequency
Gang Wei Summary
- Gang Wei, based in Cupertino, CA, US, is currently a Vice President Global Engineering at Visteon Corporation. Gang Wei brings experience from previous roles at Honeywell, Foxconn, Laird Performance Materials and Texas Instruments. Gang Wei holds a Illinois Institute of Technology. With a robust skill set that includes RF, Antennas, Business Strategy, Cross-functional Team Leadership, Electronics Technology and more. Gang Wei has 2 emails and 3 mobile phone numbers on RocketReach.
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