Forced Physics DCT Information

JouleForce™ is a patented air-based cooling platform that pushes direct-to-chip cooling past the practical limits of conventional heat sinks, without a drop of water. Cooling is now constraining deployment. AI accelerators are moving into 1,000 to 2,000 watt power envelopes and rack density is rising faster than conventional air architectures can support. Liquid cooling handles the heat load, but it brings CDUs, manifolds, hoses, leak risk, facility plumbing and long retrofit cycles. We built a third path. JouleForce uses patented microchannel arrays to change how air interacts with the heated surface. The boundary layer that caps conventional heat sinks never fully forms, so heat leaves along the full length of every channel wall. Thermal resistance comes in around 50% lower at roughly one third the airflow, measured against a conventional air heat sink under matched conditions. What JouleForce takes out of the design matters as much as what it delivers. No pumps, CDUs, manifolds or hoses. No facility water anywhere near live compute. Short rack-level retrofits instead of building projects, and the same air-cooled service model teams already run. Independent testing by Dr. Alfonso Ortega, head of Villanova University's Laboratory for Advanced Thermal and Fluid Systems, reproduced our results within 5% and confirmed materially lower thermal resistance across the test range. We continue to prove the architecture on live CPUs, GPUs, accelerators and ASICs. One core architecture scales from a chip cooler to server, rack and edge deployments. We work with silicon providers, server OEMs, thermal manufacturers and data center operators, and every engagement starts the same way. Tell us the target hardware, power envelope, ambient conditions and deployment environment, and we scope an evaluation around measurable thermal and performance targets.