Feng Lu Location
- California, United States
Feng Lu Work
- 2023 - now Associate Vice President @
- 2021 - 2023 Company Co-CTO, Head of R and D Institute @
- 2018 - 2021 Wireless modem and chipset engineering lead at Qualcom @
- 2016 - 2018 Wireless modem Engineering Lead @
- 2003 - 2016 Wireless systems engineering lead (Director level) @
- 2003 - 2003 Engineering Intern @
Feng Lu Education
- Purdue University
Ph.D (Electrical Engineering)
2000 - 2003 - Purdue University
MSEE (Electrical Engineering)
1998 - 1999 - Shanghai Jiao Tong University
BE (Electronic Engineering)
1993 - 1998
Feng Lu Skills
- Technology Roadmapping
- Customer-Premises Equipment (CPE)
- Semiconductor Engineering
- Automotive Communications
- CV2X
- Millimeter Wave Communications
- C Level Management
- C-Level Leadership
- Executive Presentation Skills
- Executive-level Communication
- R&D Funding
- Telecommunications
- Analytical Skills
- Systems Engineering
- Management
- Leadership
- Project Management
- Automotive Electronics
- Wireless Networking
- Cellular Communications
- 5G
- Strategic Planning
- Customer Engagement
- Executive Leadership
- Professional Mentoring
- Investor Relations
- Mobile Communications
- HSPA
- CDMA
- LTE
- ASIC
- Digital Signal Processors
- 3G
- RF
- Signal Processing
- 4G
- WCDMA
- 3GPP
- HSDPA
- Mobile Devices
- Algorithms
- Wireless
- Wireless Technologies
- Public Speaking
- Modems
- Microsoft Excel
Feng Lu Summary
- Feng Lu, based in California, United States, is currently a Associate Vice President at MediaTek. Feng Lu brings experience from previous roles at ESWIN and Qualcomm. Feng Lu holds a 2000 - 2003 Ph.D in Electrical Engineering @ Purdue University. With a robust skill set that includes Technology Roadmapping, Customer-Premises Equipment (CPE), Semiconductor Engineering, Automotive Communications, CV2X and more. Feng Lu has 2 emails and 1 mobile phone numbers on RocketReach.
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