Feng Lu's Location

California, United States

Feng Lu's Work

  • Company Co-CTO, Head of R and D Institute @ ESWIN
  • Wireless modem and chipset engineering lead at Qualcom @ Qualcomm
  • Wireless modem Engineering Lead @ Qualcomm
  • Wireless systems engineering lead (Director level) @ Qualcomm
  • Engineering Intern @ Qualcomm

Feng Lu's Education

  • Purdue University

    Ph.D (Electrical Engineering)

    2000 - 2003
  • Purdue University

    MSEE (Electrical Engineering)

    1998 - 1999
  • Shanghai Jiao Tong University

    BE (Electronic Engineering)

    1993 - 1998

Feng Lu's Skills

  • Mobile Communications
  • HSPA
  • CDMA
  • LTE
  • ASIC
  • Digital Signal Processors
  • 3G
  • RF
  • Signal Processing
  • 4G

Feng Lu's Summary

Feng Lu, based in California, United States, is currently a Company Co-CTO, Head of R and D Institute at ESWIN, bringing experience from previous roles at Qualcomm. Feng Lu holds a 2000 - 2003 Ph.D in Electrical Engineering @ Purdue University. With a robust skill set that includes Mobile Communications, HSPA, CDMA, LTE, ASIC and more, Feng Lu contributes valuable insights to the industry. Feng Lu has 2 emails and 1 mobile phone number on RocketReach.

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