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Feng Location
San Jose, CA, US
Feng Work
Research Engineer @ (March 2020 - Present)
Principal Engineer @ (November 2019 - February 2020)
Sr Process and Material Engineer @ Samsung Semiconductor (May 2014 - August 2019)
Magnetic Sensor Engineer @ (October 2013 - April 2014)
Guest Researcher and NIST-UMD associate @ (October 2012 - September 2013)
Guest Researcher @ (February 2010 - September 2012)
Research Assistant @ (November 2007 - January 2010)
Feng Education
Trinity College, Dublin
Ph.D. (Physics)
2003-2007
Beihang University
Bachelor (Materials Science)
1995-2002
Feng Skills
Thin Films
AFM
Nanotechnology
Sputtering
Characterization
Nanofabrication
Chemical Mechanical Polishing
Powder X-ray Diffraction
Electron Beam Lithography
Magnetics
Sensors
Microfabrication
Semiconductors
Physics
Clean Rooms
Scanning Electron Microscopy
Nanomaterials
FIB
Photolithography
Powder X Ray Diffraction
Mechanics
Electron Beam
SAN
Scanning Electron
Chemical Mechanical
Electro
R&D
Feng Summary
Feng, based in San Jose, CA, US, is currently a Research Engineer at College of Nanoscale Science and Engineering. Feng brings experience from previous roles at Western Digital, Samsung Semiconductor, MagArray, Inc. and National Institute of Standards and Technology. Feng holds a 2003 - 2007 Ph.D. in Physics @ Trinity College, Dublin. With a robust skill set that includes Thin Films, AFM, Nanotechnology, Sputtering, Characterization and more. Feng has 1 emails on RocketReach.
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